AzureWave Technologies has announced a 11n, Bluetooth 3.0 and high speed (HS) wireless module IC to enhance the wireless experience for mobile devices which require high bandwidth and better power efficiency.
AzureWave will demonstrate the 11n/BT combo module IC embedded devices at CES 2010.
This wireless module IC has a small footprint, edging wireless performance, flexible power management and multiple OS support for multitasking smartphones and mobile devices. The Wi-Fi and Bluetooth coexistence guarantees seamless and smooth data transfer, the company claimed.
Combining the latest Bluetooth 3.0 technology and HS, the wireless module IC can support a wide variety of mobile devices to quickly and easily transfer rich media content, and implement high speed synchronization with other BT 3.0 and HS enabled devices.
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...
Photo: Company
Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...
Photo: Company
Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...
Photo: Company
Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...
Photo: Company
Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...
Photo: Company
- Silicon photonics set for takeoff (Oct 30) - EE Times
- TikTok founder becomes China's richest man (Nov 1) - BBC News
- Nvidia to take Intel's spot on Dow Jones Industrial Average (Nov 1) - Reuters
- Huawei's latest AI processors were made by TSMC (Oct 22) - Bloomberg
- Arm to scrap Qualcomm chip design license in feud escalation (Oct 23) - Bloomberg
- Embedded World brings 3,500 visitors to 1st US outing (Oct 11) - EE Times
- Preparing electronics engineering students for industry (Oct 8) - EETimes Europe
- Former Apple hardware chief Dan Riccio is retiring (Oct 11) - Ars Technica
![]()
Microsoft's custom chip sets new industry benchmark while deepening AI partnerships across sectorsAs Microsoft transitions from a software giant to a cloud leader, with its cloud business now accounting...
![]()
Global supply chain: Key componentsKey components news coverage
CSP in-house development of ASIC accelerators
Google TPUs will see a share of over 70% in the in-house developed cloud ASIC accelerator market in 2024; an all-optical network...
AI chip market outlook 2023-2028: Insights from demand and supply perspectives
The growing demand for AI computational power is accelerating advancements in hardware and chip technology, necessitating innovation...
Automotive CIS tech development, 2024
The popularization of autonomous driving is boosting demand for automotive CIS with LFM and HDR being mainstream development...
