Lantiq has announced its latest generation chipset for ADSL linecards.
Implemented in 65nm process technology, the new GEMINAX XXS V3 chipset offers high-level integration with an up to 36-channel data pump in a 17x17mm BGA package. It offers small ADSL footprint while being about 30% smaller than existing solutions, the company said.
While linecards with current generation ADSL chipsets typically feature 72 channels, the new GEMINAX XXS V3 allows designing systems with 96 or more channels on a single linecard. Systems using GEMINAX XXS V3 will reduce typical power consumption of a DSLAM by at least 12% compared to existing equipment.
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...
Photo: Company
Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...
Photo: Company
Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...
Photo: Company
Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...
Photo: Company
Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...
Photo: Company
- Luc Van den hove: Aim high, be ambitious, but stay humble (Dec 19) - EE Times
- Intel shortlists suitors for programmable chip arm Altera (Dec 20) - Bloomberg
- South Korean president declares martial law (Dec 3) - The Financial Times
- China dials up US trade tension with tit-for-tat metals ban (Dec 3) - Bloomberg
- Silicon photonics set for takeoff (Oct 30) - EE Times
- TikTok founder becomes China's richest man (Nov 1) - BBC News
- Nvidia to take Intel's spot on Dow Jones Industrial Average (Nov 1) - Reuters
- Huawei's latest AI processors were made by TSMC (Oct 22) - Bloomberg
![]()
South Korea's FuriosaAI takes on global AI chip race with 'RNGD'FuriosaAI, a Seoul-based AI chip startup founded in 2017, is making waves in the AI hardware market...
![]()
TASTI 2024From groundbreaking satellite advancements to international collaboration on space exploration, DIGITIMES Asia delivers comprehensive coverage of TASTI...
Global investment plans of Japanese IDMs
Geopolitical tensions prompt Japanese IDMs to gather capacities in Japan's Kyushu and Tohoku regions and prioritize their OSAT...
CSP in-house development of ASIC accelerators
Google TPUs will see a share of over 70% in the in-house developed cloud ASIC accelerator market in 2024; an all-optical network...
AI chip market outlook 2023-2028: Insights from demand and supply perspectives
The growing demand for AI computational power is accelerating advancements in hardware and chip technology, necessitating innovation...
