Samsung Electronics is mass producing ePoP (embedded package on package) memory, a single memory package consisting of 3GB LPDDR3 DRAM, 32GB eMMC and a controller.
For use in high-end smartphones, the thin ePoP can be stacked directly on top of the mobile processor.
The 3GB LPDDR3 mobile DRAM inside the ePoP operates at an I/O data transfer rate of 1,866Mb/s, and sports a 64-bit I/O bandwidth.
Because of its thinness and heat-resistant properties, Samsung's smartphone ePoP does not need any space beyond the 225mm2 (15 by 15mm) taken up by the mobile application processor. A conventional PoP (also 15 by 15mm), consisting of the mobile processor and DRAM, along with a separate eMMC (11.5mm by 13mm) package, takes up 374.5mm2.
The single-package configuration also meets the semiconductor package height ceiling of 1.4mm, Samsung said.
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