LG Electronics has introduced the V60 ThinQ dual-screen smartphone featuring 5G connectivity, upgraded audio, video and photo capabilities.
The V60 comes features two rear cameras and a time of flight (ToF) sensor array - a 64MP main camera lens for sharper, brighter images and a 13MP wide angle lens. The V60 supports 8K video recording.
Four high-performance microphones allow for recording sounds from various directions, according to the vendor. The device also offers Voice Bokeh, a feature that separates users' voices from background noise, allowing content creators to place more focus on the subject while reducing excess noise. Also included is the LG 3D Sound Engine, an audio processing technology first introduced on LG OLED TVs. It recognizes the type of content and optimizes the sound accordingly for a more cinematic quality.
The V series device comes with a 5,000mAh battery and Qualcomm Snapdragon 865 with the Qualcomm Snapdragon X55 5G modem.
Both the main and second screens are 20.5:9 ratio 6.8-inch FHD+ P-OLED displays.
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...
Photo: Company
Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...
Photo: Company
Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...
Photo: Company
Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...
Photo: Company
Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...
Photo: Company
Japan's semiconductor revival must not only involve Taiwan but also include strategic cooperation with...
As 2024 comes to a close, we look back at the major topics and events across multiple industry sectors, including EVs, AI, semiconductors, servers, and...
Global investment plans of Japanese IDMs
Geopolitical tensions prompt Japanese IDMs to gather capacities in Japan's Kyushu and Tohoku regions and prioritize their OSAT...
CSP in-house development of ASIC accelerators
Google TPUs will see a share of over 70% in the in-house developed cloud ASIC accelerator market in 2024; an all-optical network...
AI chip market outlook 2023-2028: Insights from demand and supply perspectives
The growing demand for AI computational power is accelerating advancements in hardware and chip technology, necessitating innovation...