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NEWS TAGGED 12-INCH
Wednesday 8 July 2009
Winbond completes transition to 300mm fab production
Taiwan's Winbond Electronics, which has shifted its focus from standard DRAM to niche memory and NOR flash, has recently completed its migration to 300mm wafer fab production, according...
Monday 6 July 2009
IC tester Ardentec increases 2009 capex
Wafer testing house Ardentec recently adjusted upward its capex budget for 2009.
Thursday 2 July 2009
TSMC processes over five million 12-inch wafers based on sub 0.13-micron nodes
Taiwan Semiconductor Manufacturing Company (TSMC) has cumulatively shipped over five million 12-inch equivalent wafers of chips processed with sub 0.13-micron processes, according...
Tuesday 30 June 2009
Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu
Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...
Wednesday 24 June 2009
Intel to produce on 65nm in China
Intel's upcoming 12-inch fab in China will initially focus on 65nm production, according to Kirby Jefferson, general manager of the new fab (Fab 68). Intel is scheduled to commence...
Tuesday 23 June 2009
Winbond moving toward reliance on NOR flash, specialty DRAM
Winbond Electronics has been transforming its product mix through phasing out standard DRAM and maintaining NOR flash and specialty DRAM as a focus, according to company president...
Friday 19 June 2009
PSC refutes rumors it plans to reduce stake in Rexchip
Powerchip Semiconductor Corporation (PSC) has dismissed rumors that it may have to lower its stake in Rexchip Electronics, or hand over one of its 12-inch fabs to the joint venture,...
Friday 12 June 2009
Macronix seeking partnership for 12-inch fab
Taiwan's Macronix International, a mask ROM and NOR flash chipmaker, is looking to forge a partnership with a foundry to help complete its 12-inch fab plan, according to company chairman...
Thursday 11 June 2009
ACM Research finding strength in megasonic cleaning tool: Q&A with CEO David Wang
ACM Research has developed a 300mm single-wafer megasonic cleaning tool, which has been adopted by several leading foundry houses, according to company founder and CEO David Wang...
Tuesday 9 June 2009
TSMC continuing 12-inch fab expansion
Taiwan Semiconductor Manufacturing Company (TSMC) is continuing to expand its 12-inch wafer foundry capacity, aiming at an 11% increase from 2008 and to account for 42% of its aggregate...
Wednesday 27 May 2009
Lenovo launches Ion-based 12-inch netbook
Lenovo has announced the IdeaPad S12 netbook, featuring a 12.1-inch screen, full-size keyboard and new graphics options with the Nvidia Ion platform.
Monday 4 May 2009
Inotera to ship 50% of DRAM to Micron
Inotera Memories has said it will start supplying half of the DRAM output from its 12-inch fabs, formerly reserved for Qimonda, to Micron Technology in the third quarter of 2009,...
Wednesday 22 April 2009
TSMC spends NT$20 billion on 40nm equipment
Taiwan Semiconductor Manufacturing Company (TSMC) has spent a total of NT$20 billion (US$590 million) on new equipment since the end of February to expand the 40nm node at its 12-inch...
Wednesday 22 April 2009
TSMC profits drop in 2008
Taiwan Semiconductor Manufacturing Company (TSMC) has announced that consolidated revenues on a US GAAP basis were NT$334.34 billion (US$9.9 billion) for 2008, with an earnings per...
Tuesday 21 April 2009
ProMOS may sell 12-inch fabs to Taiwan Memory, sources claim
ProMOS Technologies will likely spin off its 12-inch wafer fabs to assist in establishing Taiwan Memory Company (TMC), which has been identified as a government-led project to overhaul...