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NEWS TAGGED 12-INCH
Thursday 6 August 2009
HHNEC and GSMC proposed 12-inch fab placed on hold again
Long-proposed plans for China-based wafer foundries Hua Hong NEC (HHNEC) and Grace Semiconductor Manufacturing Corporation (GSMC) to jointly set up a 300mm (12-inch) fab has reportedly...
Friday 31 July 2009
China white-box players eye AMD and VIA for netbooks larger than 12-inches, says paper
White-box netbook makers in China have recently started to manufacture netbooks with panels sized larger than 12-inches that adopt either an AMD or VIA processor platform, as market...
Friday 24 July 2009
KYEC revises capex plan for 2009 on demand for 12-inch wafers
King Yuan Electronics Company (KYEC) on July 23 announced its board of directors has approved plans to raise its capex budget to NT$1.6 billion (US$48.68 million) for 2009, a 60%...
Friday 24 July 2009
UMC gearing up for 40nm
United Microelectronics Corporation (UMC) has been working closely with customers, including FPGA specialist Xilinx, to volume produce 45/40nm products at its 300mm (12-inch) fabs,...
Friday 17 July 2009
Inotera to issue GDRs to fund 50nm transition
Inotera Memories' board of directors has decided to issue GDRs equivalent to a total of up to 800 million stocks in order to raise around NT$10 billion (US$303.81 million). The funding...
Thursday 9 July 2009
Production capacity key to DRAM survival, says Inotera president
Taiwan-based DRAM makers should optimize capacity at their 12-inch fabs, which is the key to their survival in the global memory industry, according to Charles Kao, president of Inotera...
Wednesday 8 July 2009
Winbond completes transition to 300mm fab production
Taiwan's Winbond Electronics, which has shifted its focus from standard DRAM to niche memory and NOR flash, has recently completed its migration to 300mm wafer fab production, according...
Monday 6 July 2009
IC tester Ardentec increases 2009 capex
Wafer testing house Ardentec recently adjusted upward its capex budget for 2009.
Thursday 2 July 2009
TSMC processes over five million 12-inch wafers based on sub 0.13-micron nodes
Taiwan Semiconductor Manufacturing Company (TSMC) has cumulatively shipped over five million 12-inch equivalent wafers of chips processed with sub 0.13-micron processes, according...
Tuesday 30 June 2009
Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu
Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...
Wednesday 24 June 2009
Intel to produce on 65nm in China
Intel's upcoming 12-inch fab in China will initially focus on 65nm production, according to Kirby Jefferson, general manager of the new fab (Fab 68). Intel is scheduled to commence...
Tuesday 23 June 2009
Winbond moving toward reliance on NOR flash, specialty DRAM
Winbond Electronics has been transforming its product mix through phasing out standard DRAM and maintaining NOR flash and specialty DRAM as a focus, according to company president...
Friday 19 June 2009
PSC refutes rumors it plans to reduce stake in Rexchip
Powerchip Semiconductor Corporation (PSC) has dismissed rumors that it may have to lower its stake in Rexchip Electronics, or hand over one of its 12-inch fabs to the joint venture,...
Friday 12 June 2009
Macronix seeking partnership for 12-inch fab
Taiwan's Macronix International, a mask ROM and NOR flash chipmaker, is looking to forge a partnership with a foundry to help complete its 12-inch fab plan, according to company chairman...
Thursday 11 June 2009
ACM Research finding strength in megasonic cleaning tool: Q&A with CEO David Wang
ACM Research has developed a 300mm single-wafer megasonic cleaning tool, which has been adopted by several leading foundry houses, according to company founder and CEO David Wang...
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