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NEWS TAGGED 12-INCH
Tuesday 9 June 2009
TSMC continuing 12-inch fab expansion
Taiwan Semiconductor Manufacturing Company (TSMC) is continuing to expand its 12-inch wafer foundry capacity, aiming at an 11% increase from 2008 and to account for 42% of its aggregate...
Wednesday 27 May 2009
Lenovo launches Ion-based 12-inch netbook
Lenovo has announced the IdeaPad S12 netbook, featuring a 12.1-inch screen, full-size keyboard and new graphics options with the Nvidia Ion platform.
Monday 4 May 2009
Inotera to ship 50% of DRAM to Micron
Inotera Memories has said it will start supplying half of the DRAM output from its 12-inch fabs, formerly reserved for Qimonda, to Micron Technology in the third quarter of 2009,...
Wednesday 22 April 2009
TSMC spends NT$20 billion on 40nm equipment
Taiwan Semiconductor Manufacturing Company (TSMC) has spent a total of NT$20 billion (US$590 million) on new equipment since the end of February to expand the 40nm node at its 12-inch...
Wednesday 22 April 2009
TSMC profits drop in 2008
Taiwan Semiconductor Manufacturing Company (TSMC) has announced that consolidated revenues on a US GAAP basis were NT$334.34 billion (US$9.9 billion) for 2008, with an earnings per...
Tuesday 21 April 2009
ProMOS may sell 12-inch fabs to Taiwan Memory, sources claim
ProMOS Technologies will likely spin off its 12-inch wafer fabs to assist in establishing Taiwan Memory Company (TMC), which has been identified as a government-led project to overhaul...
Tuesday 21 April 2009
Semiconductor equipment makers wary of 450mm development, says The Information Network
The planned transition to 450mm diameter silicon wafers for semiconductor production will be disastrous for the equipment industry, The Information Network said.
Monday 20 April 2009
IM Flash likely to beat Hynix in 2009 ranking, says DRAMeXchange
IM Flash Technologies, a joint venture between Intel and Micron Technology, may overtake Hynix Semiconductor and become the third-largest NAND flash supplier worldwide in 2009, according...
Monday 13 April 2009
Integrated handheld solutions driving demand for wafer-level packaging, says ASE
Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...
Monday 13 April 2009
TSMC speeds up 12-inch fab expansion
Taiwan Semiconductor Manufacturing Company (TSMC) has completed fourth-phase expansion to its 12-inch facility, Fab 12, at the Hsinchu Science Park (HSP), where production at the...
Wednesday 1 April 2009
TSMC and PSC deny equipment purchase rumors
Taiwan Semiconductor Manufacturing Company (TSMC) and Powerchip Semiconductor Corporation (PSC) have dismissed recent rumors that the DRAM maker intends to sell its equipment to the...
Monday 23 March 2009
TSMC resumes production as orders surge
Taiwan Semiconductor Manufacturing Company (TSMC) has returned to almost full production, buoyed by a surge in short lead time orders for handset chips, telecom products and graphics...
Monday 23 March 2009
DRAM chipmakers Nanya and Inotera gain capital support from Formosa Plastics
Taiwan's Nanya Technology and Inotera Memories have received additional capital of over NT$10 billion (US$296 million) from parent company the Formosa Plastics Group, according to...
Friday 20 March 2009
ProMOS responds to production halt rumors
ProMOS Technologies has responded to a Chinese-language Economic Daily News (EDN) report which claimed the DRAM maker intends to halt production at its 12-inch fabs in Hsinchu,...
Wednesday 18 March 2009
FlipChip announces 300mm strategic partnership with SMIC
FlipChip International (FCI), which specializes in flip-chip bumping and wafer level packaging, has recently announced a partnership alliance with Semiconductor Manufacturing International...
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research