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NEWS TAGGED 200MM
Friday 2 March 2018
Almost 100 IC wafer fabs closed or repurposed from 2009-2017, says IC Insights
Semiconductor manufacturers around the world have closed or repurposed 92 wafer fabs from 2009-2017, according to data compiled by IC Insights.
Friday 20 October 2017
IC makers maximize 300mm, 200mm wafer capacity, says IC Insights
With the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates. The...
Thursday 12 October 2017
Pure-play foundries boosting presence in China
With the rise of fabless IC companies in China, demand for foundry services in the country has also increased. In total, pure-play foundry sales in China are expected to increase...
Monday 31 July 2017
GlobalWafers strikes deal with Samsung, says report
Taiwan-based GlobalWafers has signed a 2-3 year deal with Samsung Electronics under which GlobalWafers will provide Samsung a certain amount of silicon wafers at no fixed purchased...
Tuesday 18 July 2017
Installed 8-inch fab capacity to rise through 2020, says SEMI
Installed 8-inch (200mm) fab capacity has increased since 2009, and will reach close to 5.4 million wafers per month (wpm) by the end of 2017, according to SEMI. By 2020, 200mm capacity...
Monday 10 July 2017
NSIG hires former MEMC CEO
China's National Silicon Industry Group (NSIG) has hired Nabeel Gareeb, former CEO of MEMC Electronic Materials, to help it establish a materials eco-system in China.
Wednesday 29 March 2017
Hua Hong seeing robust smart-card chip demand
Hua Hong Semiconductor, a China-based pure-play 8-inch foundry, expects its shipments for smart-card chips to continue enjoying robust growth in 2017.
Tuesday 28 March 2017
SMIC exploring opportunities in IoT boom
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) is engaged in growing its presence in the Internet of Things (IoT) field, with its enhanced mature technology...
Tuesday 24 January 2017
Hua Hong to intro 3rd-gen super-junction MOSFET process in 1H17
Hua Hong Semiconductor is already engaged in the R&D of its third-generation super-junction MOSFET process platform, which will be introduced to the market globally in the first...
Friday 16 December 2016
Number of chipmakers using 300mm wafers less than half those using 200mm wafers, says IC Insights
Prior to 2008, 200mm wafers were used in more cases for manufacturing ICs than any other wafer size. However, since 2008, the majority of IC fabrication has taken place on 300mm wafers,...
Thursday 13 October 2016
Installed 200mm fab capacity rising, says SEMI
Installed 200mm fab capacity has increased since 2009. By 2020, capacity is expected to reach 5.5 million wafers per month (wpm), although this is still less than the 2007 peak, according...
Tuesday 11 October 2016
Chipmakers continue to maximize 300mm and 200mm wafer capacity, says IC Insights
Enormous financial and technology hurdles continue to plague the development of 450mm wafers, and ambitious goals to put 450mm wafers to use have been scaled back. IC manufacturers...
Tuesday 23 August 2016
Hua Hong ships 1.2 billion MCUs in 1H16
Hua Hong Semiconductor, a China-based pure-play 200mm (8-inch) foundry, has announced shipments for microcontrollers (MCU) climbed 50% from a year earlier to 1.2 billion chips in...
Tuesday 1 March 2016
Taiwan passes South Korea to become No.1 in total IC wafer fab capacity, says IC Insights
As of December 2015, Taiwan led all regions/countries in wafer capacity with nearly 22% of worldwide IC capacity installed in the country, according to IC Insights. Taiwan surpassed...
Wednesday 21 October 2015
200mm wafer fab capacity to reach 5.4 million wspm in 2018, says SEMI
Worldwide 200mm semiconductor wafer fab capacity is forecast to reach 5.2 million wafer starts per month (wspm) in 2015, and will expand to 5.4 million wspm in 2018, according to...