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NEWS TAGGED 200MM
Monday 14 September 2015
Companies maximize 300mm, 200mm wafers; slow progress on 450mm, says IC Insights
Worldwide capacity by wafer size was dominated by 300mm wafers in 2014, and is forecast to continue increasing through 2019, according to IC Insights.
Thursday 10 September 2015
Equipment spending slows but still positive in 2015 and 2016, says SEMI
Front-end fab equipment spending (including new, used, and in-house) is projected to increase 5% in 2015 to US$37 billion, and rise another 6.6% in 2016 to US$39.4 billion, according...
Wednesday 17 June 2015
IC manufacturers close or repurpose 83 wafer fabs from 2009-2014, says IC Insights
Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity in order to produce devices more cost-effectively on larger wafers...
Wednesday 5 February 2014
300mm capacity dominates but life remains for 200mm wafer fabs, says IC Insights
Nearly all new fab upgrade and construction activity has to do with 300mm wafer processing, but there is still plenty of life remaining in 200mm fabs, according to IC Insights.
Thursday 20 December 2012
Interview with AZZURRO Semiconductors CEO Erwin Wolf: Mass production of 200mm GaN-on-Si wafer will drive significant shift of LED market
With excellent cost advantages, GaN-on-Si technology has become a new focus in the LED market in order to cope with the severe price pressure for LED makers. In recent years, this...
Wednesday 26 January 2011
Tight capacity forces semiconductor production efficiencies in 2010, says Semico
The semiconductor industry enjoyed over 30% revenue growth in 2010, with unit sales also rising an impressive 31%, according to Semico Research. But wafer demand, based on semiconductor...
Tuesday 27 April 2010
Silicon demand set to rebound robustly in 2010, says iSuppli
Following a weak 2009, global demand for silicon used in semiconductor manufacturing is expected to rebound robustly in 2010, led by shipments of 300mm (12-inch) wafers, according...
Wednesday 3 March 2010
BCD platform technologies are rapidly changing the power IC landscape, says Petrov Group
The emergence of state-of-the-art BCD (Bipolar-CMOS-DMOS) platform technologies is having a far reaching effect on the analog/mixed-signal IC landscape, the Petrov Group has commented...
Friday 15 January 2010
Globalfoundries aims to ramp output to 5.8 million 200mm wafer equivalents in 2014
Globalfoundries has completed its integration with Chartered Semiconductor Manufacturing, and aims to ramp its total capacity to 5.8 million 200mm (8-inch) wafers in equivalent in...
Wednesday 21 October 2009
CSMC inks licensing deal with IBM for 0.18-micron RF CMOS process
CSMC Technologies, a China-based specialty foundry provider, has signed an agreement with IBM to license its proprietary 0.18-micron radio frequency (RF) CMOS process. The process...
Friday 31 July 2009
NAND flash ASPs up 20% in 2Q09, says DRAMeXchange
Production cutbacks and demand for restocking inventory from emerging markets pushed up NAND flash ASPs by about 20% sequentially in the second quarter of 2009, according to DRAMeXchange...
Monday 20 April 2009
IM Flash likely to beat Hynix in 2009 ranking, says DRAMeXchange
IM Flash Technologies, a joint venture between Intel and Micron Technology, may overtake Hynix Semiconductor and become the third-largest NAND flash supplier worldwide in 2009, according...
Thursday 19 February 2009
NAND flash market prepares for rush orders
The NAND flash market is gearing up for an influx of rush orders, according to market sources. However, bit growth for the sector will still suffer a signficant drop in 2009, which...
Thursday 18 September 2008
Hynix to accelerate retirement of 200mm fabs, to reduce capacity by 30% by early 2009
Hynix Semiconductor said that the company will retire its 200mm wafer fabrication plants, which are less efficient than 300mm fabs earlier than planned in order to improve its financial...