Nvidia continues to introduce downgraded versions of its AI and gaming GPUs for the Chinese market, which remains important to the US chip vendor, according to industry sources. New...
Demand for High-Bandwidth Memory (HBM) and DDR5 RAM for servers has steadily risen as Cloud Service Providers (CSP) in North America continue building data centers, with IC distributor...
VinFast, a Vietnam-based EV maker rapidly expanding its global presence, announced a delay in its operation for its manufacturing facility in North America, according to an official...
Samsung is set to launch its sixth generation of High-Bandwidth Memory (HBM), HBM4, in 2025 and will differentiate its HBM technology through customized optimization services by leveraging...
Samsung has announced plans to expand its support for DSPs (Design Service Partners) to help South Korean IC design companies deepen their presence in the HPC (High-Performance Computing)...
SK Hynix, the South Korean memory giant, is ramping up its recruitment of system semiconductor experts, especially targeting staff from Samsung Foundry and IC design, according to...
Samsung's recent announcement of securing a 2nm chip order from Japan's AI accelerator developer Preferred Networks (PFN) has sparked discussions about the actual production progress...
Screen unveils its three-year mid-term business plan, aiming to increase its overseas R&D spending to address advancements in semiconductor process miniaturization, while also...
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to set a new industry record, reaching $109 billion in 2024, growing 3.4%...
According to Bloomberg citing UBS forecasts, Taiwan Semiconductor Manufacturing Company (TSMC) could spend up to US$37 billion in capex in 2025, marking a 15.6%...
Unimicron Technology aims to expand its share of the high-end IC substrate market and surpass Japanese competitors by 2025, according to T. J. Tseng, chairman of the Taiwan-based...
A new semiconductor back-end process R&D alliance, US-JOINT, is set to launch in Silicon Valley in 2025. The alliance will focus on next-generation semiconductor packaging technologies...
While Japanese manufacturers have long been at the forefront of bipedal humanoid robot development, recent AI breakthroughs from the US and China's IT industry have propelled these...
Japan Advanced Semiconductor Manufacturing (JASM), a subsidiary of Taiwan Semiconductor Manufacturing Company (TSMC), is set to significantly increase its workforce in spring 2025...
