Samsung Electronics plans to introduce samples of its next-generation LPDDR6 memory by late 2025, addressing the growing demand for on-device AI solutions. The initiative aims to...
In a sweeping analysis of the AI sector, Sequoia Capital projects a widening competitive moat among leading cloud providers through 2025, as infrastructure buildout reaches critical...
Aegiverse is betting big on fiber-optic gyroscopes (FOG) as military demand for resilient navigation systems surges amid growing drone and satellite deployments. The National Central...
Samsung Display (SDC) recently announced its routine personnel changes, naming Vice President Joohyung Lee as the new head of its most profitable division, the small- and medium-sized...
Although Apple has received much flak for the lack of innovation in the external design of recent iPhones, the much-rumored iPhone 17 Air is now said to have entered the new product...
According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh momentum into the semiconductor...
The European automotive supply chain encountered significant hurdles in 2024 as electrification demand fell short of expectations, leading to low investment returns and widespread...
Taiwan's National Center for High-performance Computing (NCHC), under the National Applied Research Laboratories (NARLabs), plans to build an AI supercomputing center in Tainan by...
Apple's Vision Pro, its first mixed-reality (MR) headset, is approaching its first anniversary in February 2025. However, projections for 2024 shipments stand at just 500,000 units,...
As competition in the smartphone market intensifies, Samsung Electronics aims to regain its competitive edge with AI features. However, there are concerns regarding the effectiveness...
At SEMICON Japan 2024 in Tokyo, Rapidus Chairman Tetsuro Higashi revealed that the installation of all equipment for trial production of 2nm chips will be finalized by March 2025,...
Connector and cable assembly maker Sinbon Electronics has seen a drop in revenue, as inventory destocking beginning in the second half of 2023 led to slower demand. For the first...
Innovative IC substrate manufacturer Phoenix Pioneer Technology is undergoing a strategic transformation into advanced packaging. The company is developing cutting-edge xQFN lead...
Semiconductor materials distributors are experiencing strong growth driven by advanced packaging demand, with expectations for continued expansion through 2025. Industry players are...
