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NEWS TAGGED AMKOR
Friday 3 December 2021
ASE obtains major orders for new Qualcomm mobile SoC
Taiwan's leading backend house ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have obtained major orders for processing Qualcomm's just-unveiled flagship...
Thursday 25 November 2021
TSMC outsources part of CoWoS packaging production to OSATs
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...
Monday 22 November 2021
Southeast Asia roundup: Amkor plans to invest US$1.6 bn in Vietnam
South Korea-based semiconductor house is building up capacity in Vietnam while Toyota sets up base in Thailand.
Thursday 18 November 2021
Qualcomm to scale down modem chip supply for iPhones
Qualcomm will sharply cut back its modem chip supply for Apple's iPhones starting 2023, sparking speculation that Apple will have its in-house developed modem solution ready for the...
Tuesday 9 November 2021
Qualcomm growing presence in PA segment to benefit Taiwan III-V partners
As Qualcomm is actively expanding its presence in the GaAs-based handset PA segment, its partners in Taiwan including foundries Win Semiconductors and Advanced Wireless Semiconductor...
Friday 17 September 2021
Chipmakers working with partners to step up deployments in 5G RF devices
Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...
Friday 20 August 2021
Amkor: Empowering RF front end cellular innovations with DSMBGA
With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other...
Monday 2 August 2021
TSMC, Amkor to process IPD chips for new Apple devices
Apple is expected to significantly increase the adoption of IPD (integrated passive devices) for new iPhones and other iOS products, providing robust business opportunities for manufacturing...
Monday 28 June 2021
Backend demand for HPC chips strong, but ABF substrate support matters
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
Tuesday 20 April 2021
ASE stepping up purchases of automated wire-bonding machines
Taiwan's top OSAT company ASE Technology Holding has been stepping up its purchases of more automated wire-bonding packaging machines to expand capacity for clients, while also enhancing...
Monday 22 February 2021
Qualcomm gearing up to cement capacity support from Taiwan partners
Qualcomm has been gearing up to seek multiple supply sources for both silicon-based and III-V semiconductors amid increasingly tight capacity at the global IC value chain, and reportedly...
Thursday 3 December 2020
ASE obtains FC packaging orders for new Qualcomm 5G SoC
ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...
Monday 16 November 2020
ASE quietly enhancing CIS backend capability
ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...
Monday 16 November 2020
ASE reportedly joins Sony supply chain for automotive CIS
ASE Technology reportedly has become Sony's second backend partner for processing automotive CMOS imaging sensors (CIS), marking its return to the CIS packaging segment following...
Monday 9 November 2020
Top foundries to maintain tight partnerships with OSATs, says Amkor executive
Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...