Nvidia CEO Jensen Huang's exclamation of the arrival of "AI's iPhone moment" sparked an explosive demand for AI HPC (high-performance computing) chips. For 2.5D advanced packaging...
ASE Technology (ASEH) and Amkor Technology, the world's top two OSATs, have both expanded production outside of China and Taiwan, according to industry sources.
Apple will reportedly have its own 5G modem chip, with OSATs such as the ASE Technology Holding (ASEH) and Amkor Technology competing for orders, according to market sources.
Automotive mmWave radars are widely believed to become important supporting components for future vehicles. Major OSATs including China's JCET, Taiwan's ASE Technology, and US-based...
Amkor Technology and GlobalFoundries (GF) have formed a strategic partnership that will enable a comprehensive EU/US supply chain from semiconductor wafer production at GF to OSAT...
As fab utilization rates fall due to slowing customer orders, OSATs have implemented cost-cutting measures such as encouraging employees to take leave, according to industry source...
A slowdown in customer orders has forced all staff at OSAT Amkor Technology's production site in Shanghai, estimated at about 5,000 people, to take vacation for about a week, according...
Demand for custom-built chips from system vendors remains promising for OSATs that offer high-end backend services, such as ASE Technology (ASEH), Amkor Technology and Powertech Technology...
The new 14-and 16-inch MacBook Pro models just unveiled by Apple both support the newest Wi-Fi 6E (802.11ax) wireless communication standard, which is expected to notably drive up...
Qualcomm has contracted both Amkor Technology and Siliconware Precision Industries (SPIL) to provide backend services for its just-unveiled flagship smartphone SoC, according to industry...
The semiconductor industry players are forming a regional cluster in Europe, with the support of EU's semiconductor initiative to decrease its dependence on Asia. Seeing growing demand...
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...
System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...
Ever-advancing datacenter, server, networking and AI applications continue to drive R&D momentum for diverse HPC chip solutions, and Arm-based HPC chips, in particular, have been...
