China backend service providers such as Tongfu Microelectronics, Tianshui Huatian Technology, Jiangsu Changjiang Electronics Technology have been actively raiding talent from Taiwan's...
Taiwan's Environmental Protection Administration (EPA) has started its environmental impact assessment on land designated for construction of a new plant by Taiwan Semiconductor Manufacturing...
Amkor Technology has unveiled its new plant in Taiwan to focus mainly on high-end IC backend services, such as wafer-level and flip-chip packaging, and high-end chip probing.
Amkor Technology will soon start operating a new factory at its manufacturing site in Longtan, northern Taiwan for wafer-level packaging (WLP) and wafer test services. The arrival...
Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has been enhancing its IC packaging capability by developing system-level packaging technology.
Major China-based OSAT companies including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Tianshui Huatian Technology are all gearing up to compete...
The 22nd annual SEMICON Taiwan trade show has kicked off in Taipei, running from September 13-15, with this year's theme focusing on IoT, AI, smart manufacturing, smart transportation...
Amkor Technology and Nanium, a Portugal-based IC backend house specializing in wafer-level fan-out (WLFO) packaging solutions, have entered into a definitive agreement for Amkor to...
A proposed merger between Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) is still being reviewed by anti-trust authorities in China and the US...
Qualcomm has announced the opening of Qualcomm Communication Technologies (Shanghai), a semiconductor test facility in the Waigaoqiao (WGQ) free-trade zone in Shanghai, and its first...
China-based IC backend service company Nantong Fujitsu Microelectronics reportedly will acquire US-based Amkor Technology, according to a Chinese-language Economic Daily News...
Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology has announced it is ramping up a new MEMS and sensor packaging line...
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have agreed to merge through the formation of a parent holding company, which would allow both...
Advanced Semiconductor Engineering (ASE), already a provider of SiP (system-in-package) modules for the first-generation Apple Watch, has reportedly grabbed the majority of SiP module...
