Taiwanese OSAT leader Advanced Semiconductor Engineering (ASE) has recently announced its plan to bolster overseas production by acquiring Infineon's backend assembly and testing...

The AI surge is anticipated to substantially boost demand for advanced packaging, which is already in short supply, according to sources at backend houses.

ASE Technology Holding (ASEH) will be stepping up its advanced packaging and testing capabilities in the second half of 2024, when a new cycle begins after the completion of inventory...

According to industry sources, IC material distributors anticipate customer inventory adjustments will end in the first half of 2024, with AI expected to accelerate growth in the...

OSATs ASE Holdings (ASEH) and Jiangsu Changjiang Electronics Technology (JCET) are both looking to capitalize on the AI market potential.

As geopolitical concerns rise, many backend companies have chosen Malaysia as a new base for plant expansions, according to industry sources.

With TSMC and ASE Holdings (ASEH) gearing up to build additional fab capacities for advanced packaging, relevant supply chain participants are optimistic about growth driven by their...

Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.

IC backend houses anticipate a resurgence in demand during the latter part of 2024 after a disappointing 2023.

Generative AI was behind Nvidia's 240% surge in market cap in 2023, and the effect also trickled down to foundry manufacturers and packaging & testing service providers in the...

Semiconductor demand is improving gradually, with IC packaging and testing houses expressing optimism about market prospects for 2024 and focusing on AI chips and Co-Packaged Optics...

OSAT Advanced Semiconductor Engineering (ASE) will acquire facilities from its fully-owned subsidiary ASE Test to boost packaging capacity, according to the former's parent company,...