Taiwan-based leading PCB maker Zhen Ding Technology and Austria's AT&S are set to enter the high-end ABF substrate segment where demand will stay robust through 2025, both making...
ABF substrate supply is likely to remain short of demand through 2023 although makers in Taiwan, Japan and South Korea have all geared up capacity expansions at the request of chipmaking...
Apple reportedly has enlisted AT&S as a new supplier of BT-based AiP (antenna in package) substrates for new 5G mmWave iPhones to be released later in the year, expanding to five...
Intel, AMD and Nvidia are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025, according to...
PCB makers in the supply chain of iPhones are expected to see only limited growth in ASPs this year due to insignificant specs upgrades in SLP (substrate-like PCB) mainboards for...
BT substrate vendors in the supply chain of Apple devices are all gearing up shipments for next-generation Apple Watch, AirPods and iPhone devices, which will all massively adopt...
IC substrate supplier Unimicron Technology is accelerating the construction of its new plant in Yangmei, northern Taiwan, and expects the facility to get ready for full-scale production...
AT&S has disclosed plans to invest EUR1.7 billion (US$2.07 billion) to set up a new production base for ABF substrates in Southeast Asia to satisfy the needs of its major HPC...
The global supply of IC substrates will not see major inprovement until late 2021 or 2022 when Taiwan-based suppliers' additional capacity comes online, according to industry sourc...
Major Taiwan-based IC substrate suppliers Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are negotiating with AMD a new form of supply deals under which the suppliers...
Unimicron Technology has obtained funds from the local government in Kunshan, China for relocating its manufacturing operations locally out of environmental concerns, and will have...
Suppliers of semiconductor components and materials, such as CCL and PCBs, have all geared up for the upcoming release of Intel's Whitley next-generation server CPU platform.
Wearing a helmet camera as we know it from ski races on TV, or a smartphone gimbal, a technician is walking through the production hall showing a customer, with whom he is connected,...
Zhen Ding Technology, Compeq Manufacturing and Unimicron Technology have together landed nearly 60% of total substrate-like PCB (SLP) orders placed by Apple for its new iPhone 12...
Suppliers of SLP (substrate-like PCB) boards for the next-generation iPhone devices (tentatively named iPhone 12) have been ramping up shipments of related products since July-August,...
