Taiwan's direct Internet connection with 12 countries (including Hong Kong and Macau) reached bandwidth of 2.147Tbps in fourth-quarter 2017, decreasing 4.02% sequentially but increasing...
MediaTek and the Taiwan government-backed Industrial Technology Research Institute (ITRI) have jointly developed a LWA (LTE/Wi-Fi Link Aggregation) prototype system and other technologies...
Micron Technology has announced a new 32GB NVDIMM-N offering twice the capacity of existing NVDIMMs, providing system designers and original equipment manufacturers (OEMs) with new...
Taiwan's direct Internet connection with 12 countries and regions reached total bandwidth of 2.237Tbps as of third-quarter 2017, increasing 2.50% sequentially and 25.86% on year,...
Intel has provided updates for its 10nm process and plans for 10nm FPGAs, as well as the availability of its 64-layer 3D NAND for data center applications. The disclosures were made...
Xilinx, ARM, Cadence Design Systems and TSMC have announced a collaboration to build the first CCIX (cache coherent interconnect for accelerators) test chip in TSMC 7nm FinFET process...
Fingerprint sensor supplier Egis Technology (Egistec) has announced August consolidated revenues grew 34.6% sequentially to a record high of NT$544 million (US$18.1 million).
Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...
EDA vendor Synopsys has introduced its complete DesignWare high bandwidth memory-2 (known as HBM2) IP solution consisting of controller, PHY and verification IP, enabling designers...
Taiwan-based Global Unichip, an IC design service company partnering with Taiwan Semiconductor Manufacturing Company (TSMC), is looking to expand its business in the artificial intelligence...
Taiwan's direct Internet connection bandwidth with 12 countries (including Hong Kong and Macau) reached of 2.182Tbps at the end of the second quarter of 2017, increasing 4.19% on...
Samsung Electronics has increased the production volume of its 8GB high bandwidth memory-2 (HBM2) to meet growing market needs across a wide range of applications including AI, high-performance...
Toshiba has announced development of its BiCS flash three-dimensional (3D) flash memory utilizing through-silicon via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC)...
Taiwan's National Communications Commission (NCC) has said it will begin accepting bids from July 19 to September 1 for the release of 2100MHz and 1800MHz frequency band units for...
Credo Semiconductor, a developer of serializer-deserializer (SerDes) circuits, technology and IP cores, and Foxconn Interconnect Technology, a supplier of interconnect solutions,...
