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NEWS TAGGED BGA
Tuesday 25 May 2021
ASE promotes embedded die packaging for automotive electronics
Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...
Friday 21 May 2021
OSE to expand EMS services, boost partnership with Chipbond
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Tuesday 16 March 2021
Backend firms to gain growth momentum from car chips till 3Q21
Taiwan's backend service firms will see their ratios of revenues from processing automotive chips ramp up through at least the third quarter 2021, according to industry sources.
Tuesday 16 March 2021
IC and material distributors to embrace strong 2Q21
Taiwan-based distributors of ICs and materials continue to see strong influx of orders, which will buoy their sales performance through the second quarter, according to industry so...
Wednesday 10 March 2021
Taiwan OSATs post revenue increases in February
Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...
Wednesday 3 March 2021
BGA packaging for memory controller ICs hits snag on ABF substrate shortages
Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...
Wednesday 27 January 2021
PTI set to boost logic IC backend revenue ratio to 50% in mid-2021
Memory backend specialist Powertech Technology (PTI) is gearing up to expand its business in the logic IC field in 2021 with focus placed on flip-chip packaging and bumping services,...
Monday 25 January 2021
Automotive CIS backend business set to boom throughout 2021
Taiwan's CMOS image sensor (CIS) backend specialists including Tong Hsing Electronic Industries are poised to embrace major growth momentum throughout 2021 as they have landed one-year...
Monday 14 December 2020
All-round OSAT: Q&A with PTI CEO Boris Hsieh
Taiwan-based Powertech Technology (PTI) is one of the world's top OSATs with major backend orders from non-Korean memory vendors. PTI has just completed a top management shakeup after...
Monday 16 November 2020
ASE reportedly joins Sony supply chain for automotive CIS
ASE Technology reportedly has become Sony's second backend partner for processing automotive CMOS imaging sensors (CIS), marking its return to the CIS packaging segment following...
Friday 18 September 2020
Leadframe makers see OSAT vendors step up pace of orders
Leadframe makers have seen OSAT providers including ASE Technology and Greatek Electronics step up their pace of orders for QFN (quad flat no-lead) leadframes to meet robust wire-bonding...
Tuesday 18 August 2020
ASE breaks ground for new advanced packaging fab in Taiwan
ASE Technology has broken ground for a new smart plant in Kaohsiung, southern Taiwan to be dedicated to advanced packaging processes, with annual production estimated at US$500 million...
Tuesday 14 July 2020
CIS backend firms tap deeper into auto field with On-Semi, Sony
With major CMOS image sensor (CIS) vendors including On Semiconductor and Sony set to put increased focus on automotive applications, Taiwan-based backend houses including Tong Hsing...
Wednesday 3 June 2020
PS5 processor shipments to kick off in June, peak in 3Q20
Backend IC packaging and testing service providers will begin shipments of the customized SoCs designed by AMD specifically for PlayStation 5 (PS5) to their downstream partners in...
Friday 10 April 2020
Tong Hsing CIS, RF modules packaging business thriving on strong demand
Tong Hsing Electronic Industries, a specialist in wafer reconstruction, micro module assembly and backend services for CMOS image sensors and other niche ICs, continues to enjoy strong...