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Friday 18 September 2020
Leadframe makers see OSAT vendors step up pace of orders
Leadframe makers have seen OSAT providers including ASE Technology and Greatek Electronics step up their pace of orders for QFN (quad flat no-lead) leadframes to meet robust wire-bonding...
Tuesday 18 August 2020
ASE breaks ground for new advanced packaging fab in Taiwan
ASE Technology has broken ground for a new smart plant in Kaohsiung, southern Taiwan to be dedicated to advanced packaging processes, with annual production estimated at US$500 million...
Tuesday 14 July 2020
CIS backend firms tap deeper into auto field with On-Semi, Sony
With major CMOS image sensor (CIS) vendors including On Semiconductor and Sony set to put increased focus on automotive applications, Taiwan-based backend houses including Tong Hsing...
Wednesday 3 June 2020
PS5 processor shipments to kick off in June, peak in 3Q20
Backend IC packaging and testing service providers will begin shipments of the customized SoCs designed by AMD specifically for PlayStation 5 (PS5) to their downstream partners in...
Friday 10 April 2020
Tong Hsing CIS, RF modules packaging business thriving on strong demand
Tong Hsing Electronic Industries, a specialist in wafer reconstruction, micro module assembly and backend services for CMOS image sensors and other niche ICs, continues to enjoy strong...
Thursday 12 March 2020
Micron samples uMCP with LPDDR5
Micron Technology has begun sampling what the company claims is the industry's first universal flash storage (UFS) multichip package (uMCP) with low-power DDR5 (LPDDR5) DRAM. The...
Thursday 27 December 2018
China OSAT firms foraying into higher-end packaging fields
China-based OSAT (outsourced semiconductor assembly and test) firms are gearing up to tap into medium to high-end packaging fields, including the flip chip (FC) packaging segment...
Tuesday 26 June 2018
Micron begins volume production of GDDR6
Micron Technology has announced volume production on its 8Gb GDDR6 memory, which is optimized for a variety of applications that require high performance memory including artificial...
Wednesday 31 January 2018
Logic IC packager Greatek upbeat about revenues for 2018
After scoring impressive revenue and profit records in 2017, Taiwan-based logic IC packaging firm Greatek Electronics, an affiliate of Powertech Technology (PTI) , is quite optimistic...
Monday 15 January 2018
IC packager Greatek eyes revenues rise on more international orders in 1Q18
Taiwan-based logic IC packaging and testing specialist Greatek Electronics is expected to enjoy stable revenue growth in the first quarter of 2018 from increasing ratio for orders...
Tuesday 8 August 2017
Macronix intros new OctaFlash to power instant-on applications
Macronix International has announced its new Ultra-OctaFlash Memory designed to meet the growing demand for "instant-on" performance and real-time system responsiveness in automotive,...
Wednesday 1 June 2016
Samsung announces mass production of 512GB NVMe SSD in single BGA package
Samsung Electronics has begun mass producing NVM Express (NVMe) PCIe SSD solutions in a single ball grid array (BGA) package for next-generation PCs and ultra-slim notebooks, according...
Thursday 3 December 2015
New FC BGA substrate plant to boost Unimicron 2016 revenues, says report
Revenues generated at Unimicron Technology's new flip-chip ball-grid array (FC BGA) substrate plant will reach NT$500 million (US$15.3 million) per month in 2016, up from about NT$350...
Thursday 12 February 2015
InnoDisk smart flash memory storage solutions aiming for IoT devices
IoT devices, which have been receiving a great deal of attention from the global ICT industry have several major characteristics: versatility, reliability, security, small-size, mobility...
Friday 21 December 2012
Intel likely to figure a way to keep LGA design for CPUs, says Asustek executive
Commenting on Intel's reported plans of abandoning CPU socket designs and changing to directly soldered CPUs after two years, Asustek Computer vice president and general manager of...