Taiwan-based ball-grid array (BGA) solder sphere maker Shenmao Technology saw its consolidated revenues increase 6.4% sequentially to hit a year-high of NT$575 million (US$17.86 million)...
Shenmao Technology has expanded its production capacity of ball-grid array (BGA) solder spheres, its main product line, by 70% to meet orders from new clients, according to the com...
AMD has announced immediate availability of two new dual-core, 18W TDP processors for the scalable ASB1 BGA embedded client platform, the Turion Neo X2 processor Model L625 and the...
Nan Ya Printed Circuit Board (NPC) has forecast its revenue ratio between the first and second halves of 2009 may be between 30:70 and 40:60, according to company president Otto Chang...
IC testing house King Yuan Electronics Company (KYEC) stands a good chance of enjoying double-digit sales growth sequentially in the third quarter of 2009, thanks to improved order...
Shenmao Technology is optimistic about its second-quarter outlook, and market watchers expect its revenues to grow 40-50% in the quarter, with strong sales of solder paste and ball-grid...
Material supplier Shenmao Technology received orders for ball-grid array (BGA) solder spheres from two connector customers earlier in March and will begin volume shipments in April,...
