Avalue Technology, a global industrial PC solution provider and an associate member of the Intel Internet of Things Solutions Alliance, is bringing the new Intel Atom Embedded Industrial...

IC backend houses are being encouraged to increase production capacity in Southeast Asia, especially for BGA packaging, according to industry sources.

BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with...

The new 14-and 16-inch MacBook Pro models just unveiled by Apple both support the newest Wi-Fi 6E (802.11ax) wireless communication standard, which is expected to notably drive up...

Asia's first-tier suppliers of car-use CMOS image sensors (CIS) and microcontroller units (MCU) have shown a relatively clear attitude that they would hike quotes to fully reflect...

Like handset CMOS image sensors, automotive CIS will likely be built based on the backend wafer reconstruction technology for a shorter verification cycle, according to industry so...

Taiwan's IC test interface specialists including Chunghwa Precision Test Tech (CHPT) are striving hard to strengthen deployments in multiple market segments beyond handsets as demand...

International IDMs such as Onsemi and Sony are keenly expanding capacities for automotive CMOS image sensors (CIS) to meet ever-mounting demand for ADAS applications, and their backend...

Different types of SiP (system in package) solutions are facing diverse challenges, and can be materialized only through close cooperation among related semiconductor supply chain...

Eternal Materials, which specializes in resin materials and dry-film photoresists, continues to enjoy strong shipments for high-frequency and high-speed substrates, while seeing orders...

The supply of leadframes for chip packaging has been tight, with the visibility of orders from international IDMs for automotive and industrial applications extended to 2023, according...

China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...

Backend houses including Xintec, ShunSin Technology and Tong Hsing Electronic Industries are expected to post brisker sales results for the second half of 2021 after posting impressive...

Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing...

ASE Technology has reported revenue grew 2.3% sequentially and about 18% on year to NT$42.27 billion (US$1.53 billion) in May 2021, a record high for the same month, and its January-May...