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NEWS TAGGED BGA
Tuesday 24 August 2021
China OSATs strengthen QFN packaging capability for car chips
China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...
Wednesday 14 July 2021
Taiwan CIS backend firms to embrace strong 2H21
Backend houses including Xintec, ShunSin Technology and Tong Hsing Electronic Industries are expected to post brisker sales results for the second half of 2021 after posting impressive...
Thursday 17 June 2021
Tong Hsing to expand packaging capacity for automotive CIS
Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing...
Friday 11 June 2021
ASE Technology posts record revenues for May
ASE Technology has reported revenue grew 2.3% sequentially and about 18% on year to NT$42.27 billion (US$1.53 billion) in May 2021, a record high for the same month, and its January-May...
Tuesday 25 May 2021
ASE promotes embedded die packaging for automotive electronics
Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...
Friday 21 May 2021
OSE to expand EMS services, boost partnership with Chipbond
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Tuesday 16 March 2021
Backend firms to gain growth momentum from car chips till 3Q21
Taiwan's backend service firms will see their ratios of revenues from processing automotive chips ramp up through at least the third quarter 2021, according to industry sources.
Tuesday 16 March 2021
IC and material distributors to embrace strong 2Q21
Taiwan-based distributors of ICs and materials continue to see strong influx of orders, which will buoy their sales performance through the second quarter, according to industry so...
Wednesday 10 March 2021
Taiwan OSATs post revenue increases in February
Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...
Wednesday 3 March 2021
BGA packaging for memory controller ICs hits snag on ABF substrate shortages
Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...
Wednesday 27 January 2021
PTI set to boost logic IC backend revenue ratio to 50% in mid-2021
Memory backend specialist Powertech Technology (PTI) is gearing up to expand its business in the logic IC field in 2021 with focus placed on flip-chip packaging and bumping services,...
Monday 25 January 2021
Automotive CIS backend business set to boom throughout 2021
Taiwan's CMOS image sensor (CIS) backend specialists including Tong Hsing Electronic Industries are poised to embrace major growth momentum throughout 2021 as they have landed one-year...
Monday 14 December 2020
All-round OSAT: Q&A with PTI CEO Boris Hsieh
Taiwan-based Powertech Technology (PTI) is one of the world's top OSATs with major backend orders from non-Korean memory vendors. PTI has just completed a top management shakeup after...
Monday 16 November 2020
ASE reportedly joins Sony supply chain for automotive CIS
ASE Technology reportedly has become Sony's second backend partner for processing automotive CMOS imaging sensors (CIS), marking its return to the CIS packaging segment following...
Friday 18 September 2020
Leadframe makers see OSAT vendors step up pace of orders
Leadframe makers have seen OSAT providers including ASE Technology and Greatek Electronics step up their pace of orders for QFN (quad flat no-lead) leadframes to meet robust wire-bonding...