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Friday 4 June 2010
Broadcom to launch Maestro wireless connect middleware
Broadcom plans to launch its in-house developed wireless connect middleware, the Maestro, for design-in by terminal-end and peripheral device makers as well as by other chipset vendors...
Friday 4 June 2010
Broadcom talks about growing opportunities in wireless
Michael Hurlston, senior vice president and general manager for the Home and Wireless Networking Business Unit at chip specialist Broadcom recently sat down with Digitimes to share...
Thursday 3 June 2010
Computex 2010: Broadcom, Atheros, Ralink and Realtek showcasing latest 802.11n wireless solutions for Internet TVs and STBs
Broadcom and Atheros Communications as well as Taiwan-based WLAN chipmakers Ralink Technology and Realtek Semiconductor all are showcasing their latest 802.11n wireless solutions...
Wednesday 5 May 2010
Broadcom tapping China EPON market, says executive VP
Broadcom has been cooperating with the three largest mobile telecom carriers in China to set up interoperability standards for 10G EPON (Ethernet Passive Optical Network) technology...
Monday 29 March 2010
Broadcom reportedly tells clients WLAN chip supply may ease in May or June
Broadcom reportedly has informed its downstream clients in Taiwan that the supply of its WLAN chips will ease in May or June 2010, according to industry sources.
Monday 28 December 2009
Delivery lead time for Ethernet switch chips to maintain at 16-20 weeks in 1Q10, say sources
The currently long delivery lead times of 16-20 weeks for Ethernet switch chips from most chip vendors, including Broadcom, will continue in the first quarter of 2010, defying seasonal...
Thursday 17 December 2009
Broadcom to ship single chip Blu-ray Disc solution
IRVINE, Calif., Dec 15, 2009 -- Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that it is the first...
Wednesday 9 December 2009
WLAN chip players strengthening cooperation with China networking device makers
International WLAN chip vendors are stepping up their cooperation with China-based device makers – a move that will challenge the leading position of Taiwan-based suppliers...
Wednesday 25 November 2009
Broadcom single-board Wi-Fi/Bluetooth combo solution selected by notebook vendors
Broadcom's new Wi-Fi and Bluetooth single-board combo solution has been adopted by Acer, Asustek Computer and Lenovo, which tend to use its Taiwan-based rivals' solutions for entry-level...
Tuesday 27 October 2009
UMC snatches 65nm chip orders from TSMC customers, says paper
United Microelectronics Corporation (UMC) recently offered foundry quotes of around US$4,500 per wafer for 65nm process, 10% lower than those from Taiwan Semiconductor Manufacturing...
Wednesday 30 September 2009
TSMC to see better-than-expected 4Q09
Taiwan Semiconductor Manufacturing Company (TSMC) is expected to see revenues for the fourth quarter remain flat or increase by low single-digits sequentially, according to market...
Tuesday 22 September 2009
Broadcom to begin shipping baseband ICs to Nokia, says Broadcom Taiwan
Broadcom will stat shipping handset baseband ICs to Nokia by the end of 2009, according to the company's Taiwan country manager Dana McCarty. Samsung Electronics has also begun adopting...
Tuesday 22 September 2009
HTC evaluating Broadcom as additional 3.5G chipset supplier, sources say
HTC (High Tech Computer) is evaluating the possibility of adding Broadcom to its supplier list of 3.5G chipset solutions to fulfill its goal of introducing more entry-level and mid-range...
Friday 4 September 2009
Synaptics supplies touchscreen solutions for Nokia X-series
Synaptics has secured touchscreen solution orders for Nokia's recently announced X-series handsets, according to market sources. Synaptics is expected to see record shipments of touchscreen...
Wednesday 19 August 2009
Broadcom and Ralink to separately launch integrated chips for ultra-thin notebooks by 4Q09, say IC distributors
Both Broadcom and Ralink Technology are seperately scheduled to roll out integrated chips that combine Bluetooth and WLAN capabilities for ultra-thin notebooks between the end of...