Broadcom reportedly has informed its downstream clients in Taiwan that the supply of its WLAN chips will ease in May or June 2010, according to industry sources.
The currently long delivery lead times of 16-20 weeks for Ethernet switch chips from most chip vendors, including Broadcom, will continue in the first quarter of 2010, defying seasonal...
IRVINE, Calif., Dec 15, 2009 -- Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that it is the first...
International WLAN chip vendors are stepping up their cooperation with China-based device makers – a move that will challenge the leading position of Taiwan-based suppliers...
Broadcom's new Wi-Fi and Bluetooth single-board combo solution has been adopted by Acer, Asustek Computer and Lenovo, which tend to use its Taiwan-based rivals' solutions for entry-level...
United Microelectronics Corporation (UMC) recently offered foundry quotes of around US$4,500 per wafer for 65nm process, 10% lower than those from Taiwan Semiconductor Manufacturing...
Taiwan Semiconductor Manufacturing Company (TSMC) is expected to see revenues for the fourth quarter remain flat or increase by low single-digits sequentially, according to market...
Broadcom will stat shipping handset baseband ICs to Nokia by the end of 2009, according to the company's Taiwan country manager Dana McCarty. Samsung Electronics has also begun adopting...
HTC (High Tech Computer) is evaluating the possibility of adding Broadcom to its supplier list of 3.5G chipset solutions to fulfill its goal of introducing more entry-level and mid-range...
Synaptics has secured touchscreen solution orders for Nokia's recently announced X-series handsets, according to market sources. Synaptics is expected to see record shipments of touchscreen...
Both Broadcom and Ralink Technology are seperately scheduled to roll out integrated chips that combine Bluetooth and WLAN capabilities for ultra-thin notebooks between the end of...
Order visibility at both Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) has extended to November 2009, with utilization rates expected...
Most handset chipset solution providers around the globe are experiencing a new wave of short lead-time orders as branded handset players anticipate a 30% sequential growth in the...
With the new iPhone 3GS's Bill of Materials (BOM) and feature set nearly the same as the previous model in the iPhone line, you might think the product's component selection would...
Broadcom has recently introduced a family of netbook products, including Crystal HD solution, which has been selected by Hewlett-Packard (HP) and Acer, and three InConcert modules.
