IC packaging specialist Siliconware Precision Industries (SPIL) has reported net profits of NT$240 million (US$8.1 million) for the first quarter of 2018, down 83.9% sequentially...

IC packager Siliconware Precision Industries (SPIL) has disclosed it has spent a total of NT$710.71 million (US$24.3 million) on equipment from Kulicke and Soffa Industries for its...

Advanced Semiconductor Engineering (ASE) expects its IC backend business sales to register strong sequential growth in the second quarter and grow through the fourth quarter. The...

After scoring impressive revenue and profit records in 2017, Taiwan-based logic IC packaging firm Greatek Electronics, an affiliate of Powertech Technology (PTI) , is quite optimistic...

Taiwan IC backend service providers including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and King Yuan Electronics (KYE), are upbeat about their...

IC packaging specialist Siliconware Precision Industries (SPIL) saw its net profits fall 30.5% on year to NT$6.9 billion (US$237 million) in 2017. EPS for the year came to NT$2.21...

Taiwan-based IC packager ChipMOS is expected to see its revenue growth significantly driven by the combination of its gold bumping with COF packaging services in 2018, as the company...

Taiwan-based IC packaging and testing house Sigurd Microelectronics is expected to enjoy strong revenue performance in 2018 due to more orders from Amazon for its smart speaker chips,...

ChipMOS Technologies (Shanghai), of which Tsinghua Unigroup is a major stakeholder, is expected to secure backend orders for 3D NAND flash chips developed by Yangtze River Storage...

IC packaging specialist Siliconware Precision Industries (SPIL) saw its net profits for the first three quarters of 2017 decline 23.8% from a year earlier to NT$5.41 billion (US$178.7...

Chipbond Technology's consolidated revenues climbed to a record high of about NT$5 billion (US$165.3 million) in the third quarter of 2017. Market watchers expect the company to post...

China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...

Backend houses Chipbond Technology and ChipMOS Technologies have seen orders for TDDI (touch with display driver integration) chips for use in 18:9 smartphone panels ramp up, which...

Siliconware Precision Industries (SPIL) has announced plans to invest indirectly a total of US$25 million in its newly-established wholly-owned subsidiary in China. Named Siliconware...

Speculation has circulated in the industry that Taiwan-based Chipbond Technology plans to sell part of its stake in its China-based subsidiary Chipmore Technology to BOE Technology...