Backend houses Chipbond Technology and ChipMOS Technologies have both cut into the supply chains of US and Korea smartphone brands with their gold bumping services, and are set to...
China-based Tongfu Microelectronics has struck a deal with the Xiamen Haicang District government to set up a manufacturing base for advanced packaging and testing services locally...
The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...
ChipMOS Technologies reportedly has landed orders from Samsung Electronics for providing gold bumping services on 12-inch wafers fabricated to produce AMOLED driver ICs to be used...
ChipMOS Technologies, a backend house targeting the LCD driver IC and memory chip sectors, expects rising sales generated from the LCD driver IC and mixed-signal chip sectors in the...
IC packager Siliconware Precision Industries (SPIL) has reported net profits of NT$996 million (US$33.1 million) for the first quarter of 2017, down 64.8% sequentially and 37.9% on...
Logic IC packaging firm Greatek Electronics will start production for bumping and wafer-level CSP in July 2017 which will further buoy its sales performance for the year, according...
Packaging and testing house Chipbond Technology reportedly has landed new orders for gold bumping for power amplifier (PA) components from Japan- and US-based vendors, according to...
SJ Semiconductor (SJSemi) has begun mass production of 14nm wafer bumping for Qualcomm, the companies have jointly announced. Mass production of 14nm wafer bumping in China is part...
Semiconductor Manufacturing International (SMIC) announced on September 16 that the company has signed a letter of intent with China Integrated Circuit Industry Investment Fund (CICIIF)...
Chipbond Technology, which provides backend services mainly for LCD driver ICs, will see significant growth in sales from its non-driver IC product line in the second half of 2015,...
Texas Instruments has announced it will expand its manufacturing capacity in Chengdu, China, with a 300mm wafer bumping facility. The addition of this manufacturing process in Chengdu...
Powertec Technology (PTI) announced on April 29 that it has entered into a share purchase agreement with Nepes to acquire Nepes Pte Ltd (NPL) in Singapore.
More IC testing and packaging companies in China are expected to migrate to advanced processes following Semiconductor Manufacturing International Corporation (SMIC) and Jiangsu Changjiang...
Semiconductor Manufacturing International (SMIC) and Jiangsu Changjiang Electronics Technology (JCET), an IC assembly and test services provider in China, have established a joint...
