Recent reports suggest that Chinese GPU startup Xiangdixian Computing Technology has collapsed due to funding issues and dismissed its entire workforce. However, the company later...
In the silicon photonics packaging and testing interface sector, WinWay Technology has intensified its efforts and anticipates that its co-packaged optics (CPO) product will be prepared...
Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated...
Amid Nvidia's recent record-breaking revenue, China's leading AI chipmaker, Cambricon Technologies, has not shared in the AI boom, reporting a more than 40% decline in revenue for...
South Korean battery equipment business CIS has announced its plan to merge with affiliate SNU Precision. As SFA is the largest shareholder for both companies, other related affiliated...
Chinese Outsourced Semiconductor Assembly and Test (OSAT) companies, including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics (TFME), and Tianshui Huatian...
Taiwan's Kenmec Mechanical Engineering has evolved from virtual simulations to real-world implementations, offering tailored software and hardware solutions for factory automation,...
In the past six months, China's leading GaN compound semiconductor firm Innoscience has faced patent infringement lawsuits in Germany and the US, from power component manufacturers...
Qualcomm recently announced the expansion of the Snapdragon X series at the International Radio Exhibition Berlin (IFA Berlin 2024). Company CEO Cristiano Amon expressed confidence...
China-based display solutions supplier BOE Technology has unveiled a roadmap for diversification into making glass substrates for semiconductor packaging.
The power semiconductor industry is experiencing a surge in the development of compound semiconductor materials such as gallium nitride (GaN) and silicon carbide (SiC). These advancements...
Topco Scientific, a supplier of semiconductor materials, anticipates substantial sales growth for advanced packaging materials in 2025 due to demand generated by AI applications.
Demand for AI chips should spur growth for the semiconductor industry over the next few years, the CEO of a major supplier to Taiwan Semiconductor Manufacturing Co. said, dismissing...
In the current AI development trend, Nvidia is already dominating the leading position in the AI chip market and actively expanding its influence to data centers and related areas...
