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Friday 2 August 2024
Rising demand for AI smartphones boosts Silicon Motion's Revenue above expectations in 2Q24
Silicon Motion Technology has reported revenues exceeding the top margin of its guidance, with gross margins also hitting the ceiling of its expectation range for the second quarter...
Friday 2 August 2024
SK Hynix to unveil next-gen AI memory innovations at FMS 2024
SK Hynix is set to showcase its latest advancements in its memory technologies and products at the upcoming Future Memory and Storage (FMS) 2024 event.
Friday 2 August 2024
Geopolitics prompts IQE to step up global deployment
Compound semiconductor epitaxial wafer (epi-wafer) manufacturer IQE is swiftly adjusting its global strategy by expanding outside its UK base in response to geopolitical volatility...
Friday 2 August 2024
SK Hynix considers US IPO for subsidiary Solidigm amid surging enterprise SSD demand
SK Hynix is reportedly considering an initial public offering (IPO) for its solid-state drive (SSD) subsidiary, Solidigm, in the US, following a surge in demand for enterprise SSDs...
Friday 2 August 2024
Japan pursues semiconductor leadership with additional measures
Japan has implemented additional tax incentives and other measures to vigorously pursue ambitious efforts aimed at rebuilding its semiconductor industry.
Friday 2 August 2024
AMD boosts AI data center GPU revenue forecast to US$4.5 billion amid surging demand
AMD has further raised its full-year revenue forecast for AI data center GPUs to US$4.5 billion, underscoring the surging demand for computing power driven by generative AI. The chipmaker...
Friday 2 August 2024
ASEH to set up advanced packaging fab in Japan, say sources
ASE Technology Holding (ASEH) plans to follow in TSMC's footsteps by establishing an advanced packaging fab in Kyushu, Japan, according to industry sources.
Friday 2 August 2024
IQE Taiwan to launch IPO on TWSE
IQE, a leading British manufacturer of compound semiconductor epitaxial wafers (epi-wafer), has announced that its Taiwanese operating subsidiary IQE Taiwan will launch an initial...
Friday 2 August 2024
Flagship smartphone AP market to heat up in 2H24
As the flagship smartphone AP battleground officially enters the 3nm era in the second half of 2024, MediaTek, Qualcomm, and Apple are all said to be preparing chips with vast performance...
Friday 2 August 2024
PCB and CIS manufacturers optimistic about new iPhone debut in 3Q24
PCB and CIS supply chain manufacturers are expected to see explosive orders for the iPhone 16, Apple's first AI smartphone module equipped with the A18 chip, as the peak season for...
Friday 2 August 2024
Intel announces cost reduction plan, expects to reduce tile production outsourcing to TSMC in 2026
Intel has unveiled a cost reduction plan involving significant layoffs, substantial cuts in operating expenses, and a sharp reduction in capital expenditures (capex). The announcement...
Friday 2 August 2024
China IDM CR Micro to initiate price increases for power ICs
China Resources Microelectronics (CR Micro) plans to hike pricing for power MOSFET and IGBT chips to reflect its fully utilized fab capacity, according to industry sources.
Friday 2 August 2024
Global 2024 smartphone sales likely to grow, with AI models leading
In their latest earnings report, mobile chip giants MediaTek and Qualcomm both maintained their previous forecasts for the smartphone market in the second half of 2024. Both companies...
Friday 2 August 2024
Samsung HBM3E soon to be qualified with shipments kicking off as early as August
Samsung Electronics' HBM3E memory is in the final stages of its qualification test for a significant client, and shipments are expected to commence as early as August, according to...
Friday 2 August 2024
TSMC to see HPC chip sales boom despite smartphone slowdown
TSMC has warned of a slowdown in smartphone chip demand, but is bullish about sales generated from the HPC sector.