China-based IC design major Unisoc reportedly successfully raised funds worth CNY4 billion (US$552 million). Unisoc is likely to secure further investment from Chin's Big Fund Phase...
After India approved three chipmaking proposals earlier this year, Tower Semiconductor's wafer fab proposal is in the spotlight as India's general elections conclude.
To improve development efficiency and improve product performance amid the AI trend, Samsung Electronics is reportedly incorporating AI technology into its system semiconductor development...
Nvidia CEO Jensen Huang said at a pre-Computex speech that Mercedes-Benz will adopt Nivida's Drive AV system in 2025 and other major carmakers will follow suit in 2026. While maintaining...
As the mobile phone market gears up for its traditional peak season, Win Semiconductors, the leading GaAs (gallium arsenide) wafer foundry, is poised to capitalize on the growing...
At Computex 2024, Nvidia CEO Jensen Huang unveiled ambitious plans to bolster the company's presence in Taiwan, pledging continued investments over the next few years. Nvidia aims...
Intel is still looking for the best benchmark to quantify the improvement of AI PC performance, according to company CEO Pat Gelsinger. He argued that AI is a progressive phenomena...
Confidently taking the stage at Computex Taiwan 2024, "the heartland of the ecosystem," Intel CEO Pat Gelsinger took a famous quote from Gordon Moore and added onto it by telling...
At Computex 2024, MediaTek placed a spotlight on Generative AI (GenAI) and wireless connectivity, unveiling their comprehensive suite of current products. The lineup includes mobile...
Besides presenting the CPU, NPU, and GPU architectures and products with strategic partners, AMD CEO Lisa Su also unveiled the company's ambitious plans for 2025 and beyond in her...
On June 4, TSMC hosted its annual shareholder meeting, during which the pure-play foundry re-elected its board of directors. In answer to a query at today's meeting regarding whether...
Intel has announced the industry's first Glass Core Substrate (GCS) technology for next-generation advanced packaging, which has once again attracted market discussion due to the...
The market for ABF substrates is unlikely to see shortages return until the first quarter of 2026, according to T. J. Tseng, chairman of Unimicron Technology.
