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Tuesday 4 June 2024
ABF substrate shortage unlikely to resume until 1Q26, says Unimicron
The market for ABF substrates is unlikely to see shortages return until the first quarter of 2026, according to T. J. Tseng, chairman of Unimicron Technology.
Tuesday 4 June 2024
Acer, Compal miss out on crucial supply chain for Nvidia AI chips
Nvidia CEO Jensen Huang is currently in Taiwan engaging with local partners and suppliers, which still does not include a few key local firms such as Acer and Compal Electronics,...
Tuesday 4 June 2024
Computex 2024: Focus on AI servers, AI PCs
This year's Computex is mostly centered on AI-enabled servers and PCs. However, while the opportunities for AI server firms are limitless, the outlook for AI PCs must be carefully...
Tuesday 4 June 2024
Taiwan III-V IC suppliers seeking access to 1st-tier auto supply chains
Taiwan-based III-V compound semiconductor companies are seeking to enter the automotive supply chains, eyeing business opportunities from LiDARs, according to industry sources.
Tuesday 4 June 2024
OwlTing CEO Interview: From Taiwanese blockchain startup to cross-border financial service provider
OwlTing, originally a Taiwanese startup using blockchain technologies for farm product resumes and hotelier payment systems, has made remarkable strides in transformation and acquisition...
Tuesday 4 June 2024
Why did Foxconn, which initiated MIH consortium, join NXP's SDV platform?
NXP launched the S32 CoreRide open platform for Software-Defined Vehicles (SDV) in March 2024. The industry is watching whether different SDV platforms will become connected or draw...
Tuesday 4 June 2024
Qualcomm gearing up for PC comeback, says CEO
Qualcomm is gearing up for PC sales to make a comeback with its Snapdragon X series processors, which will power new AI PC models set to hit market shelves in mid-June, according...
Tuesday 4 June 2024
Chinese chipmakers step up SiC production expansion
Chinese foundries including United Nova Technology and Silan, along with substrate suppliers, such as SICC, have all increased their Silicon Carbide (SiC) production capacity.
Tuesday 4 June 2024
AMD outlines AI accelerator roadmap through 2026
AMD has released its roadmap for forthcoming AI accelerators until 2026, which includes the MI350, which will be manufactured utilizing TSMC's 3nm process technology.
Monday 3 June 2024
SK Hynix races ahead in HBM with next-gen innovation
SK Hynix is swiftly advancing in the High-Bandwidth Memory (HBM) arena, aiming to develop next-generation HBM that incorporates computing, communication, and other advanced functions...
Monday 3 June 2024
AMD working with TSMC on 3nm chips, says Su
AMD has a close and solid relationship with TSMC on the 3nm technology, and the two companies are already working on several new product developments, according to Lisa Su, chairperson...
Monday 3 June 2024
Micron's latest HBM performance catches the eyes of South Korean competitors
Although the current High-Bandwidth Memory (HBM) market is still dominated by SK Hynix and Samsung Electronics, Micron has recently caught up rapidly. Following its earlier announcement...
Monday 3 June 2024
Samsung grapples with strikes and rivalry as SK Hynix ramps up investments
Samsung Electronics' semiconductor division is under pressure, facing fierce competition from industry rivals and internal...
Monday 3 June 2024
MediaTek announces new products for Computex, with Chromebook and new TV platform leading the way
MediaTek vice chairman & CEO Rick Tsai is set to discuss how MediaTek is driving the ubiquitous AI era during Computex 2024. Additionally, MediaTek will unveil two new chipsets:...
Monday 3 June 2024
Indian startup FermionIC aims to win the market with integrated offerings
With a growing interest in the semiconductor sector, India is seeing a rise in startups that offer niche design solutions. One of them that has stood out lately is Bangalore-based...