Chinese Outsourced Semiconductor Assembly and Test (OSAT) companies, including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics (TFME), and Tianshui Huatian...
India-based IC design house BigEndian Semiconductors raised US$3 million and aims to partner with Taiwan-based UMC to launch security chips amid the emergence of a local semiconductor...
Since carriers adopted 5G, the technology has not stopped evolving. For example, the 5G Advanced Network Solutions and the research and development of radio frequency (RF) and baseband...
In June 2024, Vanguard International Semiconductor (VIS) and NXP unveiled plans to collaborate on establishing VSMC in Singapore, where they will build a 12-inch wafer fabrication...
During a recent public discussion with Imec CEO Luc Van den Hove, MediaTek CEO Rick Tsai highlighted that there are still technical barriers to AI chip development, such as chip interconnect...
At an event in Berlin on September 4, Intel introduced the Core Ultra 200V series processors, codenamed Lunar Lake. These new processors represent Intel's most efficient x86 architecture...
As advanced Chip-on-Wafer-on-Substrate (CoWoS) technology captures the spotlight in the semiconductor industry, fan-out panel-level packaging (FOPLP), another advanced packaging technique,...
AI is bringing tremendous impacts on the semiconductor industry, creating challenges and opportunities that necessitate cooperation across the supply chain to create a sustainable...
As the global demand for chips continues to grow, Arizona is positioning itself as America's answer to Taiwan's semiconductor prowess. The state is rapidly evolving into a powerhouse...
Huawei's HiSilicon Full-Connection Conference is scheduled for September 9 in Shenzhen, just one day before Apple's annual iPhone launch event. While the timing's intent remains unclear,...
Following Broadcom's acquisition of VMware, there has been significant interest in how the two companies will evolve and whether the merger will generate any notable synergy for the...
Rohm Semiconductor has announced the use of power modules equipped with the company's fourth-generation SiC MOSFET bare chips for traction inverters in three ZEEKR EV models manufactured...
AUO believes that power-saving technology for panels will play a key role in advancing AI PCs. The company is optimistic that LTPS technology is more power-efficient than dual-layer...
The Indian government has approved Kaynes Semicon Pvt Ltd's proposal to establish a semiconductor unit in Sanand, Gujarat. This facility will contribute to the broader initiative...
STMicroelectronics (STM) is set to begin production at its new 8-inch silicon carbide (SiC) substrate plant in Chongqing, China, two months ahead of schedule.
