Seoul Semiconductor and its subsidiary Seoul Viosys recently released their financial results for the second quarter of 2024. CEO Chung-Hoon Lee emphasized the competitiveness of...

Xiaomi will release its own customized mobile SoC in the first half of 2025, according to sources in the smartphone supply chain.

Hyperscale data center operators are adopting large volumes of high-end Ethernet chips to ensure all high-end GPUs in data centers can be connected to form a massive supercomputer,...

SK Hynix announced today that it has developed the industry's first 16Gb DDR5 built using its 1c node, the sixth generation of the 10nm process.

Rapidus, aiming to begin mass production of 2-nanometer chips in Japan by 2027, is seeking significant financial support for its trial production and eventual mass production.

AI chips required by generative AI rely on finely wired and processed equipment; thus, front-end process equipment manufacturers have shifted their focus to the advanced packaging...

The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...

Kioxia, a leading Japanese NAND flash memory manufacturer, has filed for an initial public offering (IPO) on the Tokyo Stock Exchange. This highly anticipated IPO is slated for October...

As Micron and Tata Group's large semiconductor projects are under construction in Gujarat, India-based startup Suchi Semicon has announced its plan to begin providing OSAT (Outsourced...

Despite the recent downturn in automotive chip demand, most Taiwan-based IC designers remain largely unaffected and continue to intensify their efforts in the market, according to...

Cadence Taiwan country manager Brian Sung expects chip demand to start improving in the fourth quarter of 2024, with the momentum lasting throughout 2025.

Taiwanese IC design company Egis Technology (EgisTec) is actively exploring innovative opportunities in the cloud AI market through a collaboration with Arm.

IC design companies are expected to experience a particularly bleak third quarter of 2024 for non-Apple consumer devices, according to industry sources.

TSMC's first European wafer fab is set to be located in Dresden, Germany, a region already recognized as a significant chip manufacturing hub in both Germany and Europe. This decision...

As the application scope of genAI grows so does the market for its chips, with forecasts predicting explosive growth in the coming years.