Demand for flip-chip (FC) packaging particularly FC-BGA will be rising significantly driven by the HPC device market boom this year, and backend houses in Taiwan and China have seen...
Nvidia CEO Jensen Huang has unveiled the company's latest innovations covering autonomous machines, AIs, chips, supercomputers and software during his presentation at GTC 2021.
TSMC's bold US$100 billion capex plan for the next three years has greatly boosted the confidence of its ecosystem partners about bright prospects for the semiconductor industry,...
Server components including ICs, passive components, cables and chassis have seen supply growing tighter in the second quarter, according to sources from the server supply chain.
Testing houses including Sigurd Microelectronics and King Yuan Electronics have already seen their capacity fall short of demand since the start of the second quarter, driven by strong...
Taiwan-based Powertech Technology (PTI), a packaging partner for Intel's NAND flash chips, has newly landed backend SMT testing orders for CPUs from the chipmaker, and will see the...
Suppliers of semiconductor components and materials, such as CCL and PCBs, have all geared up for the upcoming release of Intel's Whitley next-generation server CPU platform.
IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer...
Taiwan-based server chassis maker Chenbro Micom expects demand for datacenters from the US and China to begin rising in April as new server CPU platforms will launch and clients'...
Taiwan's IC substrate makers with their strong technological prowess are in pole position to explore business opportunities from China's ongoing homegrown CPU development campaign,...
Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...
Nan Ya PCB has disclosed plans to spend at least NT$8 billion (US$287.5 million) in 2021, compared to a capex of NT$7.35 billion for 2020, for capacity expansions at its plants in...
With its advantages in edge computing and mobile device applications, Arm has been expanding its server solution offerings, heading towards high performance computing instead of staying...
Qualcomm will continue to fabricate its next-generation 5G mobile chip, tentatively dubbed Snapdragon 895, at Samsung Electronics built using an upgraded 5nm process, but may switch...
