Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
The total microprocessor (MPU) market is on track to exceed US$100 billion for the first time ever this year, thanks to strong increases in cellphone application processor revenue,...
ABF substrate makers have seen more of their customers eager to strike long-term agreements to ensure sufficient supplies through 2025 and even beyond, as tight supply is expected...
At Intel's Architecture Day 2021, two new X86 cores, two new datacenter SoCs and two discrete GPUs were introduced. Intel also disclosed it is among the top customers of TSMC, which...
Samsung Electronics has announced its new wearable processor, the Exynos W920. The new processor integrates an LTE modem, and is built with an advanced 5nm extreme ultra-violet (EUV)...
Major OSATs, including ASE Technology and Powertech Technology (PTI), are already engaged in talks with their substrate suppliers about orders for 2023, according to industry sourc...
Intel CEO Pat Gelsinger, at an online investors conference, has pointed out that he expects PC total available market (TAM) to grow all the way to 2022, despite the pandemic being...
ABF substrate supply is likely to remain short of demand through 2023 although makers in Taiwan, Japan and South Korea have all geared up capacity expansions at the request of chipmaking...
Intel's acquisition of Globalfoundries is unlikely, as GF's manufacturing capability that is more focused on mature and specialty process technology contradicts Intel's ambition of...
Foundry market leader TSMC has been pinpointed as a major beneficiary of the increasingly fierce competition among HPC chip providers, according to market sources.
Notebook ODMs and brand vendors continue to see their shipments constrained by chip shortages, though supply of some other components may improve later this year, according to industry...
