Taiwan-based IC test interface specialist Chunghwa Precision Test Technology (CHPT) is stepping up AI-based smart production of vertical probe cards (VPC) seeking to compete well...

Nvidia's GPU and AI solutions have seen strong demand from the datacenter market segment, and its acquisition of Arm should help complement the business.

Taiwan-based Unimicron, Nan Ya PCB and Kinsus Interconnect Technology have seen their ABF substrate capacities fully booked throughout the first half of 2021 thanks to strong demand...

Robust demand for Chromebooks from the education segment has not only led to shortages of entry-level processors and LCD panels, but also spurred demand for hard disc drives (HDDs),...

AMD is expected to see its share of the notebook processor market reach a company record-high of 20% in 2020, according to market sources.

Taiwan-based IC substrate makers including Unimicon Technology, Nan Ya PCB and Kinsus Interconnect Technology continue to see their available production capacities for ABF substrates...

Total microprocessor sales are forecast to grow 1.4% in 2020 to nearly US$79.3 billion, following a 2.4% decline in 2019, which was the first revenue drop in the worldwide MPU market...

Intel has launched its new-generation notebook processor series codenamed Tiger Lake that is built using its 10nm SuperFin technology.

With the gaming market expanding quickly in the wake of the coronavirus pandemic, Intel, AMD and Nvidia are all set to release their latest CPUs and GPUs in the second half of 2020...

Silicon Motion Technology with its PCIe Gen4 SSD controllers has reportedly cut into the supply chain of the world's top-4 notebook vendors for their new Tiger Lake products set for...

MediaTek and Qualcomm have introduced their new AI-capable mobile SoC chips designed specifically for gaming smartphones - the Helio G95 and Snapdragon 732G respectively.

Nan Ya PCB has delivered samples of SiP substrates for processing 5nm chips for validations by clients and expects to kick off shipments of such substrates by the end of 2020 at the...

IBM has revealed the next generation of its POWER central processing unit (CPU) family, designed for enterprise hybrid cloud computing.

MediaTek has introduced the Dimensity 800U as the latest addition in its 5G SoC lineup. The new chipset is designed for multi-core high performance and leading 5G+5G dual Sim dual...

Supply of notebook-use chips and components including processors, LCD panels and power chips has fallen short of demand, with the gap likely to widen to 15-20% in the third quarter,...