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Tuesday 15 September 2020
ABF substrate supply to stay tight despite no shipments for Huawei
Taiwan-based IC substrate makers including Unimicon Technology, Nan Ya PCB and Kinsus Interconnect Technology continue to see their available production capacities for ABF substrates...
Friday 11 September 2020
Total microprocessor sales to edge slightly higher in 2020
Total microprocessor sales are forecast to grow 1.4% in 2020 to nearly US$79.3 billion, following a 2.4% decline in 2019, which was the first revenue drop in the worldwide MPU market...
Thursday 3 September 2020
Intel launches 10nm Tiger Lake notebook processors
Intel has launched its new-generation notebook processor series codenamed Tiger Lake that is built using its 10nm SuperFin technology.
Thursday 3 September 2020
More choices for gamers: Q&A with Frank Soqui, GM of Intel Gaming Division
With the gaming market expanding quickly in the wake of the coronavirus pandemic, Intel, AMD and Nvidia are all set to release their latest CPUs and GPUs in the second half of 2020...
Wednesday 2 September 2020
Silicon Motion PCIe Gen4 SSD chips adopted by major notebook vendors
Silicon Motion Technology with its PCIe Gen4 SSD controllers has reportedly cut into the supply chain of the world's top-4 notebook vendors for their new Tiger Lake products set for...
Wednesday 2 September 2020
MediaTek, Qualcomm intro AI chips for gaming smartphones
MediaTek and Qualcomm have introduced their new AI-capable mobile SoC chips designed specifically for gaming smartphones - the Helio G95 and Snapdragon 732G respectively.
Friday 21 August 2020
Nan Ya delivers sample SiP substrates for 5nm chips
Nan Ya PCB has delivered samples of SiP substrates for processing 5nm chips for validations by clients and expects to kick off shipments of such substrates by the end of 2020 at the...
Wednesday 19 August 2020
IBM announces 7nm processor
IBM has revealed the next generation of its POWER central processing unit (CPU) family, designed for enterprise hybrid cloud computing.
Tuesday 18 August 2020
MediaTek expands 5G SoC lineup with Dimensity 800U
MediaTek has introduced the Dimensity 800U as the latest addition in its 5G SoC lineup. The new chipset is designed for multi-core high performance and leading 5G+5G dual Sim dual...
Thursday 13 August 2020
Notebook ODMs suffer widening component shortages
Supply of notebook-use chips and components including processors, LCD panels and power chips has fallen short of demand, with the gap likely to widen to 15-20% in the third quarter,...
Friday 7 August 2020
Taiwan notebooks, 2Q 2020

Introduction

Friday 31 July 2020
NAND flash, DRAM to remain largest IC market segments
DRAM and NAND flash are expected to repeat as the two largest IC segments again in 2020 after holding the same positions in 2019, according to IC Insights.
Tuesday 28 July 2020
Unimicron new plant set to produce ABF substrates for Intel in early 2022
IC substrate maker Unimicron Technology is slated to complete construction of a new plant in Yangmei, northern Taiwan by the end of 2020, followed by process optimization and validation...
Tuesday 28 July 2020
TSMC unlikely to build additional capacity for Intel orders
TSMC internally does not consider orders for Intel's processors as long-term ones, and therefore is unlikely to build additional production capacity for the new contract, according...
Monday 27 July 2020
TSMC EUV nodes to attract orders from Intel, sources say
Intel at its recent earnings call disclosed that its next-generation 7nm processors, including the company's first 7nm datacenter GPU design, would rely on external and internal process...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research