CONNECT WITH US
NEWS TAGGED CPU
Monday 16 November 2009
Intel announces new HPC CPU for 1H10
Intel has announced new technologies that it says will better equip scientists, researchers and engineers with the computing power to speed up science and engineering projects such...
Friday 13 November 2009
Jentech Precision to roll out heat spreaders for CPUs and graphics cards
Taiwan-based Jentech Precision Industrial, a supplier of thermal heat spreaders for game consoles, will also venture into the production of heat spreaders for CPUs and graphics cards...
Friday 13 November 2009
Intel to launch four Arrandale CPUs for mainstream notebooks in January 2010
Intel plans to launch four 32nm dual-core Arrandale CPUs (Calpella platform), the Core i5-520M, Core i5-430M, Core i3-350M and Core i3-330M, in the first half of January 2010 for...
Thursday 12 November 2009
Intel to launch three Arrandale CPUs for ultra-thin notebooks in 1H10
Intel plans to launch three 32nm dual-core Arrandale CPUs (Calpella platform), the Core i7-640UM (1.2GHz), Core i7-620UM (1.06GHz) and Core i5-520UM (1.06GHz) with price in thousand-unit...
Thursday 12 November 2009
AMD reveals future platform lineups
AMD has announced new details on its platform roadmap at the 2009 Financial Analyst Day, where senior executives, including president and Chief Executive Officer Dirk Meyer, discussed...
Tuesday 10 November 2009
Global PC processor shipments jump 23% sequentially in 3Q09, says IDC
Worldwide PC processor shipments in the third quarter of 2009 rose substantially by an all-time record level for a single quarter, according to data from IDC. PC processor unit shipments...
Wednesday 4 November 2009
AMD readies 2 desktop platforms for May 2010
AMD plans to announce a new high-end desktop platform (Leo) and mainstream platform (Dorado) in May of 2010, according to sources at motherboard makers.
Wednesday 4 November 2009
VIA introduces next generation Nano 3000 series processors
VIA Technologies has introduced its new VIA Nano 3000 series processors, bringing digital media performance and low power consumption to Windows 7-based ultra-thin notebook and all-in-one...
Tuesday 3 November 2009
NPC likely to receive FC substrate backend orders from Intel after NGK stops its supply
IC substrate supplier Nan Ya Printed Circuit Board (NPC) may see weaker order volumes in the short term because its Japan-based strategic partner NGK Spark Plugs has announced that...
Monday 2 November 2009
AMD updates CPU schedules
AMD has updated schedule to phase out several Phenom II X4 900 series CPUs, while launch a new model in 2010, according to sources at motherboard makers.
Tuesday 20 October 2009
AMD announces new Athlon II processors
AMD has announced several new AMD Athlon II processors, with AMD including dual-, triple- and quad-core processors to meet a range of computing needs. The company noted that the newly...
Friday 9 October 2009
Nvidia announces freeze in future Intel chipset development
Nvidia has announced that it officially plans stop developing chipsets for Intel CPUs moving forward, citing its ongoing licensing litigation with Intel as the main reason for the...
Wednesday 7 October 2009
Taiwan-based processor firm DMP Electronics launches US$100 netbook
Taiwan-based DMP Electronics has launched a US$100 netbook, the Edubook, that will be shipped to overseas markets in component form to be assembled by partners in other countries...
Thursday 1 October 2009
Topoint shipping micro drill bits to Japan
Taiwan-based drill bit maker Topoint Technology has begun shipping its micro drill bits to three Japan-based IC substrate makers, which will help boost the company's market share...
Tuesday 29 September 2009
Intel to offer dual-core CPUs for ultra-thin notebook platform
Intel plans to upgrade its ultra-thin notebook platform to include dual-core CPUs in the fourth quarter of 2009, according to sources at notebook makers.