Elpida Memory has developed 1Gb DDR3 SDRAM based on its 65nm XS extra-shrink process technology, according to the company, claiming that the chip is as cost-competitive as 50nm-made...
US-based FormFactor has taken the lead in obtaining certification for DDR3 wafer probe solutions from Micron Technology and has begun shipping to Taiwan-based DRAM makers Nanya Technology...
Worldwide semiconductor equipment spending is forecast to end the year with a 42.6% decline in 2009, but the market is now in the midst of a very strong growth spurt, according to...
In response to speculation that quotes for DRAM packaging and testing are likely to rise to reflect tight capacity and rising material costs, United Test and Assembly Center (UTAC)...
Faced with the transition from DDR2 to DDR3, memory packaging and testing house United Test and Assembly Center (UTAC) has seen growing demand for the next dominant DRAM technology,...
Powerchip Semiconductor Corporation (PSC) has announced net sales grew 27% sequentially to NT$5.38 billion (US$167 million) in November, the highest since July 2008. The Taiwan-based...
US-based FormFactor, in view of growing production of DDR3 chips, will offer full-wafer-contact probe cards as customized testing solutions for Taiwan-based makers to test 12-inch...
Taiwan-based Powerchip Semiconductor Corporation (PSC) is speeding up capacity expansion on a recovery in market demand, and its fourth-quarter DRAM bit growth is likely to reach...
DRAM demand from PC OEMs continues to outstrip supply in the contract market, according to Nanya Technology spokesperson Pei-lin Pai, in response to recent soft pricing in the spot...
Silicon-Power Computer & Communications, the distributor of Nanya Technology's Elixir brand products, has announced a partnership with HannStar Union, a Taiwan-based PC peripherals...
DDR3 shipments will rise to account for more than half of the global DRAM market by the second quarter of 2010, surpassing DDR2 for the first time as the leading technology for PC...
Hynix Semiconductor has announced Intel validation of 2Gb DDR3 DRAM chips using 40nm-class process technology. The chipmaker said it has begun mass producing the new chips, and expects...
Kingston Technology has announced 12GB triple-channel HyperX memory kits in support of Intel's LGA 1366 Core i7 systems. The DDR3 XMP-ready kit consists of six 2GB modules running...
With customers pushing the DDR3 generation, memory packaging and testing firms Powertech Technology (PTI), Formosa Advanced Technologies Company (FATC) and Walton Advanced Engineering...
The DRAM and NAND flash spot markets were weak this week (November 9-13), said inSpectrum. The downhill price trend for NAND flash continued as some vendors were aggressive in clearing...
