SEMICON China 2024, which was held in Shanghai on March 20-22, attracted many Japanese semiconductor equipment manufacturers to showcase their front-end and backend mature node process...
Chinese President Xi Jinping criticized "technological barriers" during Dutch Prime Minister Mark Rutte's visit to Beijing as the US pushes to tighten controls on ASML Holding NV's...
China is aggressively raising funds to support sustained double-digit annual growth in domestic chip production capacity and cultivate homegrown equipment development for import substitution,...
Global 300mm fab equipment spending for front-end facilities is forecast to reach a record US$137 billion in 2027, after topping US$100 billion for the first time in 2025, driven...
While chip design giants like Nvidia, AMD, and Intel prioritize "system-level" integration, all the six major Taiwanese EMS providers – Foxconn, Wistron, Compal, Quanta, Inventec...
At US$93.5 billion in 2023, the combined revenue of the top five Wafer Fabrication Equipment (WFE) manufacturers decreased by 1% annually due to sluggish memory spending, a macroeconomic...
Huawei Technologies Co. and its partner Semiconductor Manufacturing International Corp. relied on US technology to produce an advanced chip in China last year, according to people...
The US government is pressing allies including the Netherlands, Germany, South Korea, and Japan to further tighten restrictions on China's access to semiconductor technology, a controversial...
Topco Scientific Co., the leading provider of integrated services for semiconductor and optoelectronic key materials, stated that as semiconductor demand gradually recovers, the industry...
