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NEWS TAGGED EUV
Wednesday 1 September 2021
ASE, PTI making progress in PLP field
ASE Technology and Powertech Technology (PTI) have both stepped up their deployments in the panel-level packaging (PLP) field, and are involved in multiple computing chip design projects,...
Wednesday 1 September 2021
Fab toolmakers optimistic about demand from TSMC
TSMC's equipment suppliers remain optimistic about demand from the foundry, which has been stepping up its pace of advanced technology development and capacity expansion, according...
Wednesday 11 August 2021
Samsung intros 5nm processor for wearables
Samsung Electronics has announced its new wearable processor, the Exynos W920. The new processor integrates an LTE modem, and is built with an advanced 5nm extreme ultra-violet (EUV)...
Friday 30 July 2021
Intel could challenge TSMC in next 5 years
If Intel is able to advance its process technology on schedule, it could regain its foundry technology leadership that has been taken by TSMC in the next five years, according to...
Tuesday 27 July 2021
Intel unveils technology roadmap to power products through 2025 and beyond
Intel has revealed the roadmap of its process and packaging innovations that will power the next wave of products through 2025 and beyond.
Thursday 22 July 2021
ASML expects 35% revenue growth in 2021
ASML expects to post an around 35% revenue increase in 2021, with gross margin reaching between 51% and 52%.
Monday 12 July 2021
SK Hynix moves 1anm EUV DRAM process to mass production
SK Hynix has kicked off mass production of 8Gb LPDDR4 mobile DRAM chips built using 1anm EUV-based process technology, according to the company.
Monday 12 July 2021
Nanya expects DRAM prices to continue rally
DRAM contract prices, which registered a substantial increase in the second quarter of 2021, are expected to continue their rally in the third quarter, according to chipmaker Nanya...
Tuesday 6 July 2021
TSMC overview

Introduction

Friday 2 July 2021
Micron to adopt EUV in DRAM manufacturing by 2024
Micron Technology has disclosed plans to start implementing extreme ultraviolet (EUV) technology in the manufacture of DRAM chips by 2024.
Monday 21 June 2021
TSMC to start equipment move-in at Arizona fab as early as mid-2022
Pure-play foundry TSMC is expected to kick off equipment move-in at its new advanced 5nm fab in the US state of Arizona as early as mid 2022, according to industry sources.
Wednesday 9 June 2021
Tokyo Electron to collaborate with imec-ASML joint high NA lab
Tokyo Electron has announced the company will introduce its leading-edge Coater/Developer to the imec-ASML joint high NA EUV research laboratory (joint high NA lab) in Veldhoven,...
Monday 7 June 2021
Samsung to see non-memory chip sales boom in 2021
Samsung Electronics is expected to see sales of its non-memory business particularly the system LSI segment boom this year, buoyed by strong demand for handset application processors,...
Thursday 3 June 2021
TSMC stepping up advanced process capacity expansion
TSMC will be stepping up its advanced process capacity expansion through 2023, according to company CEO CC Wei.
Friday 14 May 2021
Samsung to boost logic chip investment to KRW171 trillion by 2030
Samsung Electronics has announced plans to invest a total of KRW171 trillion (US$151 billion) in its system LSI and foundry businesses through 2030, an increase of KRW38 trillion...