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NEWS TAGGED EUV
Friday 8 June 2018
TSMC accelerating 7nm process production plan to meet demand
Taiwan Semiconductor Manufacturing Company (TSMC) is likely to move its 7nm process technology to mass production ahead of schedule to meet growing demand from its fabless clients...
Wednesday 6 June 2018
MediaTek releases 5G modem chips set for shipment in 2019
MediaTek has newly released its 5G modem chipset solution, the Helio M70, to be fabricated using TSMC's 7nm process incorporating EUV technology, and will kick off official shipments...
Thursday 31 May 2018
Gudeng enjoys ramp-up of FOUP orders from 12-inch foundries
Gudeng Precision Industrial has enjoyed a ramp-up of front opening unified pod (FOUP) orders from 12-inch IC foundries in China and Taiwan, while shipments of its extreme ultraviolet...
Thursday 24 May 2018
Samsung unveils plan for 3nm process
Samsung Electronics has disclosed its comprehensive process technology roadmap updates down to 3nm at the annual Samsung Foundry Forum in the US.
Thursday 24 May 2018
Three China foundries gearing up for transition to sub-10nm process technology
Semiconductor Manufacturing International (SMIC) and Huali Microelectronics, and memory foundry specialist Yangtze Memory Technologies (YMTC) are all gearing up for transition to...
Tuesday 8 May 2018
Intel reportedly suspends H310 supply on tight 14nm capacity
Intel's new-generation H310 desktop processors fabricated on 14nm process reportedly have run out of supply in less than one month after the chipset was launched in early April 2018,...
Friday 20 April 2018
TSMC cuts revenue outlook for 2018
Taiwan Semiconductor Manufacturing Company (TSMC) has cut its revenue growth forecast for 2018 to 10% from the previously-estimated 10-15%, citing weaker-than-expected smartphone...
Friday 20 April 2018
EUV orders to drive ASML revenue growth in 2Q18
ASML expects to post revenues of between EUR2.5 billion (US$3.1 billion) and EUR2.6 billion in the second quarter of 2018, up from EUR2.29 billion in the prior quarter. A significant...
Monday 16 April 2018
Competition heats up in advanced IC process, equipment deployments
Top semiconductor players Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Intel are engaged in increasingly fierce competition not only in developing advanced...
Friday 23 February 2018
Samsung breaks ground on new EUV line in Hwaseong
Samsung Electronics has announced that it has broken ground on a new EUV (extreme ultraviolet) line in Hwaseong, Korea, aiming to maintain its leadership in state-of-the-art semiconductor...
Thursday 22 February 2018
Samsung and Qualcomm expand foundry cooperation on EUV process technology
Samsung Electronics and Qualcomm Technologies have announced their intention to expand their decade-long foundry relationship into EUV (extreme ultra violet) lithography process technology,...
Tuesday 6 February 2018
AGC to make expansion to supply system for EUV mask blanks
AGC Asahi Glass (AGC) has decided to drastically expand a supply system for EUV lithography mask blanks at one of its group companies, AGC Electronics, in 2018, according to the Japan-based...
Friday 26 January 2018
Toppan installs advanced photomask equipment at Shanghai plant
Toppan Photomasks has announced that additional investment will be made in new, leading-edge equipment for mass production of advanced photomasks at Toppan Photomasks Company Shanghai...
Thursday 4 January 2018
TSMC to outpace Samsung in 7nm volume production in 2018
Taiwan Semiconductor Manufacturing Company (TSMC) is ready to enjoy a sure win over Samsung Electronics in the race of 7nm process volume production in 2018, as it has secured orders...
Thursday 30 November 2017
Samsung starts mass production of 10LPP process
Samsung Electronics announced recently that its foundry business has commenced mass production of system-on-chip (SoC) products built on its second generation 10nm FinFET process...