United Microelectronics Corporation (UMC) currently focuses its R&D on 28nm and 22nm processes and related key technologies as well as 18-inch wafers, according to company central...
KLA-Tencor has introduced the Teron 600-series reticle defect inspection system to address a major transition in mask design at the 2Xnm logic (3Xnm half-pitch memory) node. The new...
R&D expenses are estimated to equal 25% of KLA-Tencor's overall sales in 2009, with the expenditure mainly on the development of next-generation products for 3X/2Xnm and beyond...
Cymer, which specializes in excimer laser illumination sources for deep ultraviolet (DUV) photolithography systems, has kicked off shipments of what it claims is the world's first...
High-priced equipment enabled the semiconductor lithography sector to grow to 25% of entire front-end equipment processing market in 2008, according to market research firm The Information...
Shipments of semiconductor equipment supplier ASM Lithography's (ASML's) extreme ultraviolet (EUV) systems for 22nm and sub-22nm process nodes are expected to kick off by 2010, according...
Sematech engineers, working closely with researchers from major resist suppliers, have demonstrated chemically amplified EUV resist (CAR) platforms that support 22nm half-pitch resolution...
