According to industry sources, TSMC plans to launch its first high-NA EUV lithography equipment at its fab site in Hsinchu, northern Taiwan, by the end of September, a quarter earlier...
India-based RIR Power Electronics is setting up India's silicon carbide (SiC) manufacturing facility in Odisha, as the country is looking to expand incentive schemes beyond logical...
As Semicon India 2024 approaches, Tower Semiconductor and the Adani Group have announced a partnership to establish a wafer fab in Maharashtra, India. This strategic collaboration...
In June 2024, Vanguard International Semiconductor (VIS) and NXP unveiled plans to collaborate on establishing VSMC in Singapore, where they will build a 12-inch wafer fabrication...
Six months ago, Intel CEO Pat Gelsinger introduced an ambitious "moonshot" initiative to match semiconductor manufacturing capacities in Europe and the US with those in Asia by 2030...
Semiconductor Manufacturing International Corporation (SMIC), China's leading foundry, is significantly expanding its production capacity with four new 12-inch wafer fabs in Beijing,...
Panel-level packaging (PLP) is promising to become a viable choice due to its cost-effectiveness and insufficient capacity for advanced chip packaging in the semiconductor industry...
Hua Hong Group, one of China's two major semiconductor foundries, trails behind Chinese industry leader SMIC in terms of both capacity and market share, holding a global market share...
The scope of the US Chips Act appears to have exceeded that of the China Integrated Circuit Industry Investment Fund II (Big Fund II), but the American government's goal of reshoring...
Having received a subsidy of EUR10 billion (US$11 billion) from the German government to complete construction and start production within three years, what is the newest progress...
TSMC's first European wafer fab is set to be located in Dresden, Germany, a region already recognized as a significant chip manufacturing hub in both Germany and Europe. This decision...
ESMC has commenced construction on a new semiconductor fabrication facility in Dresden, Germany. The joint venture between TSMC, Robert Bosch, Infineon, and NXP is investing over...
