The US Department of Commerce and SK Hynix have signed a non-binding preliminary memorandum of terms to provide up to US$450 million in proposed federal incentives under the CHIPS...
TSMC has notified clients of a 3-8% price increase for its 5nm and 3nm process manufacturing in 2025 to reflect escalating costs, according to sources at IC design houses.
Winbond Electronics, a specialty DRAM and flash memory chipmaker, has begun ramping up its DDR4 chip output in the second half of 2024, with the memory output increase expected to...
Kioxia has announced that the construction of Fab2 (K2) at its factory site in Kitakami was completed in July. K2 is the second flash memory manufacturing facility at Kioxia's Kitakami...
Japan has implemented additional tax incentives and other measures to vigorously pursue ambitious efforts aimed at rebuilding its semiconductor industry.
ASE Technology Holding (ASEH) plans to follow in TSMC's footsteps by establishing an advanced packaging fab in Kyushu, Japan, according to industry sources.
China Resources Microelectronics (CR Micro) plans to hike pricing for power MOSFET and IGBT chips to reflect its fully utilized fab capacity, according to industry sources.
Pure-play foundry United Microelectronics (UMC) expects to post a mid-single-digit sequential increase in wafer shipments with about flat growth in ASPs in the third quarter of 2024,...
Specialty IC foundry Vanguard International Semiconductor (VIS) has successfully secured orders originally intended for Chinese competitors, despite the Chinese companies offering...
In March and April 2024, the implementation unit of the US CHIPS and Science Act and the US Department of Commerce announced that Intel and TSMC received US$8.5 billion and US$6.6...
SK Hynix Inc. announced today that it has decided to invest about KRW 9.4 trillion in building the first fab and business facilities of the Yongin Semiconductor Cluster after the...
Chinese foundries have prioritized orders from domestic customers, resulting in limited availability of fab capacity for others particularly Taiwan-based ones targeting the Chinese...
According to data from the Kyushu Bureau of Economy, Trade, and Industry, from April 2021 to June 2024, there have been 100 new semiconductor-related investments announced or reported,...
TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production to begin by the end of 2027, according to sources at semiconductor...
