TSMC has received an influx of orders for CoWoS and other chipmaking equipment, the majority of which require super hot runs (SHR), according to industry sources.
Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
With Intel and Wolfspeed delaying the development of facilities in Germany, TSMC will break ground on a new plant in Dresden on August 20, which is critical for Germany, according...
L&T Semiconductor Technologies, an Indian startup set up less than a year ago, expects to begin developing chips for six automobile companies and eventually venture into the chipmaking...
TSMC has acquired Innolux's 5.5G LCD fab in Tainan, southern Taiwan, for NT$17.14 billion (US$530.8 million). The acquisition price is less than what the market had anticipated.
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
The New York Times recently published a piece expressing concern about the delay in the start of chip fabrication and sale at TSMC's Fab 21 in Arizona, despite the project...
TSMC has been placing large volumes of orders for production equipment and factory engineering projects in support of its fast capacity expansion, dispelling skepticism about the...
China's leading foundries, SMIC and Hua Hong Semiconductor, have seen their newly added 12-inch production capacity fully utilized, absorbing a surge in domestic orders.
SK Hynix is anticipated to expedite the development of its high-bandwidth memory (HBM) manufacturing and R&D fab in Indiana, with government incentives under the US CHIPS and...
Infineon has built a new plant in Kulim Hi-Tech Park, Malaysia, dedicated to generating 8-inch silicon carbide (SiC) wafers. Here are five major takeaways from the new facility's...
China-based semiconductor equipment manufacturers have expedited their domestic development efforts, foraying into the chiplet and HBM memory sectors, according to industry sources...
Infineon Technologies is set to unveil a new silicon carbide (SiC) wafer fab at its plant site in Kulim, Malaysia, which aims to move from 6-inch to 8-inch production in 2025. Malaysia's...
