While Foxconn Technology (Hon Hai Precision) is developing its EV business at full throttles, Taiwan's major ODMs including Pegatron, Quanta Computer, Wistron and Inventec are also...
Foxconn Technology Group (Hon Hai Precision), Pegatron and Quanta Computer are all poised to generate sequential sales increases in the fourth quarter of 2021 as they start fulfilling...
From 5G wireless communications to electrical vehicles (EV), open architectures, such as open radio access network (O-RAN) and MIH open EV development platform, are serving as an...
Taiwan's leading passive components maker Yageo continues to enjoy strong demand for automotive and industrial applications, but its capacity utilization rate for commodity offerings...
While EV is emerging as a new market arena for global automakers and tech players, Taiwan can take advantage of its strong prowess in software and semiconductor sectors to build a...
Apple is looking to diversify its assemblers for the Mac series to include not only Taiwan-based Quanta Computer and Foxconn Technology but also a few China-based suppliers, according...
Foxconn Technology (Hon Hai) is well prepared to leverage its software and semiconductor prowess to turn out more EVs with high performance and intelligence in 2022/2023, and will...
Three new EV models, developed by Foxconn Technology under its MIH open platform over the past year, as well as related software and hardware solutions take center stage at the Hon...
Component suppliers for Apple's new iPhones have seen no cutback in orders thus far this year, in contrast to a media report indicating Apple may slash its projected iPhone 13 production...
Apple will place orders for around 90 million units of the freshly launched iPhone 13 series with its upstream assemblers for 2021, Digitimes Research estimates.
IDMs including Infineon, Rohm and STMicroelectronics are transitioning to 8-inch wafer fabrication for third-generation semiconductors such as GaN and SiC, according to industry so...
Assemblers for the upcoming Apple Watch are scheduled to ramp up their output for the new model starting the end of September, according to industry sources.
Industrial computing device maker Adlink Technology expects its annual revenues grow steadily and top US$1 billion in 2025, with growth momentum mainly driven by the mounting penetration...
OSATs with SiP (system-in-package) technology, including ASE Technology and ShunSin Technology, are poised to gain from the ever-growing SiP demand for integrating heterogeneous chips...
Foxconn Technology (Hon Hai Precision Industry) has started installing equipment including lithography systems for high-end IC packaging at its chip plant in Qingdao, northeast China,...
