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Friday 23 July 2021
Chenbro launches the RM252/RM352 series server chassis to empower small base stations deployment in telecommunications
The highly anticipated 5G telecommunication technology has features such as high bandwidth, broad data connection, and low latency. Since its advent in 2019, 5G has been viewed as...
Thursday 21 January 2021
No capacity overbooking seen for high-end PCB products
Downstream clients have neither registered overly-high inventory levels for high-end PCB products nor overbooked capacity at PCB makers, as they are still striving to satisfy strong...
Friday 8 January 2021
Nan Ya, Kinsus see 4Q20 revenues peak on strong IC substrate demand
IC substrate suppliers Nan Ya PCB and Kinsus Interconnect Technology both saw their fourth-quarter 2020 revenues hit the year's peak, bolstered by higher prices offered by clients...
Tuesday 8 December 2020
Kinsus 4Q20 revenues to peak on strong shipments for handset applications
IC substrate maker Kinsus Interconnect Technology has reported November revenue climbed 24.7% on year to a record high of NT$2.56 billion (US$90.7 million), and is expected to see...
Thursday 12 November 2020
Unimicron reportedly sole ABF substrate supplier for Apple M1
Taiwan's Unimicron Technology reportedly is the sole supplier of ABF substrates for Apple-designed M1 chipsets powering its just-unveiled new MacBook series.
Wednesday 28 October 2020
AMD to acquire Xilinx
AMD and Xilinx have announced they have entered into a definitive agreement for the former to acquire the latter in an all-stock transaction valued at US$35 billion.
Monday 21 September 2020
Taiwan ABF substrate capacity fully booked throughout 1H21
Taiwan-based Unimicron, Nan Ya PCB and Kinsus Interconnect Technology have seen their ABF substrate capacities fully booked throughout the first half of 2021 thanks to strong demand...
Monday 24 August 2020
Six pillars bolstering Moore's Law: Q&A with Intel chief architect Raja Koduri
At the inaugural Architecture Day held in late 2018, a new technical group headed by Intel senior vice president and chief architect Raja Koduri first came up with six strategic pillars...
Friday 5 June 2020
IC substrate makers shifting focus to US clients from Huawei
Taiwan-based IC substrate makers including Unimicron Technology and Na Ya PCB are gearing up to strengthen business ties with US clients seeking to offset expected losses of orders...
Thursday 28 May 2020
Kinsus gearing up to expand presence in FCBGA, AiP fields
Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from...
Monday 20 April 2020
TSMC optimistic about HPC products in 2020
Taiwan Semiconductor Manufacturing Company (TSMC) expects significant sales from the the high performance computing (HPC) sector in 2020, an indication that chip vendors are still...
Wednesday 15 April 2020
IC inspection labs enjoy ramp-up in orders for serving HPC chips
Taiwan's IC testing and certification service labs have seen orders from the non-Apple camp ramp up drastically for inspecting and analyzing HPC chips demanding advanced-node manufacturing,...
Friday 10 April 2020
Unimicron sees clear order visibility for ABF substrates through 3Q20
Unimicron Technology has seen clear order visibility for high-end IC substrates, especially ABF substrates for processing diverse HPC and networking chips, stretching to the third...
Wednesday 8 April 2020
Nan Ya, Kinsus 1Q20 revenues spike on robust ABF substrate shipments
Robust demand for ABF substrates has significantly driven up first-quarter 2020 revenues at Nan Ya PCB and Kinsus Interconnect, with the growth momentum expected to last through at...
Monday 23 March 2020
Taiwan IC distributors see growing demand for 5G and datacenter applications despite pandemic
Taiwan-based IC distributors are seeing stable demand for chips used in cloud/edge computing, large datacenters, 5G base stations and servers, as consumers turn to services or entertainments...