Taiwan Semiconductor Manufacturing Company's (TSMC) 7nm FinFET process has obtained orders for the production of AI-capable SoCs from a number of China-based chip firms, such as Huawei's...
Taiwan Semiconductor Manufacturing Company (TSMC) has cut its revenue growth forecast for 2018 to 10% from the previously-estimated 10-15%, citing weaker-than-expected smartphone...
Bolstered by its programmability trait, FPGA (field-programmable gate array) is gaining ground in the field of high-performance computing (HPC) chips and artificial neural networks...
China's Tsinghua Unigroup has readied CNY370 billion (US$58.74 billion) to support its semiconductor deployments in the next five years, and plans to inject up to US$100 billion into...
Xilinx has introduced a new product category called adaptive compute acceleration platform (ACAP) - a highly integrated multi-core heterogeneous compute platform - for big data and...
Robust demand for niche-market ICs particularly high-speed transmission chips and FPGAs will be driving related IC distributors' revenue growth in 2018, according to industry sourc...
Despite the global smartphone market showing slowed growth momentum in 2018, some Taiwan IC channel distribution agents including Answer Technology (ANStek) and Niching Industrial...
Taiwan semiconductor sales agent Answer Technology (ANSTek) expects bright business prospects for the first half of 2018, as it has secured high-end, lucrative product lines including...
China-based Gowin Semiconductor has announced the development of its first 28nm FPGA product, the GW3AT-100, fabricated by Taiwan Semiconductor Manufacturing Company (TSMC).
While Apple has started to release more orders to AMD for high-end GPUs needed for new iMac series since September 2017, Taiwan-based outsourced semiconductor assembly and test (OSAT)...
While Nvidia is currently a leading player in the deep learning inference chip market, powered by its GPGPU (general-purpose computing on graphics processing unit) processors, other...
Intel has provided updates for its 10nm process and plans for 10nm FPGAs, as well as the availability of its 64-layer 3D NAND for data center applications. The disclosures were made...
