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Monday 9 August 2021
SiC, GaN devices to see production costs fall in next 5 years, says Infineon
Production costs for third-generation semiconductor SiC and GaN devices are expected to gradually drop to roughly the same levels as silicon-based components in the next 3-5 years,...
Tuesday 27 July 2021
Taiwan compound semiconductor output value surges 26% in 1H21
The output value of Taiwan's compound semiconductor industry grew 26.4% on year to NT$36 billion (US$1.28 billion) in the first half of 2021, according to statistics compiled by the...
Monday 12 July 2021
TSMC gearing up for advanced process leadership for automotive
TSMC is gearing up for a bigger presence in the automotive IC foundry market segment, with its newly-developed N5A process set to be available in the third quarter of 2022, according...
Friday 25 June 2021
Huawei to run foundry biz
Huawei will set up its first wafer fab in Wuhan, China's Hubei province, with production expected to kick off in phases starting 2022, according to industry sources.
Thursday 17 June 2021
China CE brands promoting GaN fast chargers
China brand vendors such as Xiaomi and Anker have rolled out their GaN-based fast charging devices for consumer technology products, which will be stimulating demand for GaN-on-Si...
Thursday 10 June 2021
IC analyzers sees booming demand for advanced foundry, packaging
Taiwan-based specialists in semiconductor materials analysis, IC test and verification services will see their sales for the second half of the year driven by continuous R&D on...
Friday 9 April 2021
Nexperia, UAES agree partnership for gallium nitride
Nexperia has announced a comprehensive partnership covering gallium nitride (GaN) power semiconductor devices with United Automotive Electronic Systems (UAES). The program will focus...
Thursday 4 February 2021
Win Semi expects PA shipments for 5G handsets to double in 2021
GaAs foundry Win Semiconductors expects sales of power amplifiers (PA) for 5G handsets to climb to 30-40% of its total PA revenues in 2021, with shipments for Wi-Fi 6E applications...
Friday 22 January 2021
NXP to highlight 5G PA modules, Wi-Fi 6E SoCs in 2021
Dutch chipmaker NXP will step up promotion for its multi-chip power amplifier (PA) modules for 5G small cells and Wi-Fi 6E SoCs in 2021, apart from automotive chips and modules.
Thursday 7 January 2021
Win Semi posts record 2020 revenue
GaAs foundry Win Semiconductors has reported revenue climbed 18.8% on year to a record high of NT$25.37 billion (US$905.71 million) in 2020.
Monday 4 January 2021
Unikorn to begin production of 100W GaN-on-Si chips
Unikorn Semiconductor, a provider of foundry services for III-V compound semiconductor components, will extend production of GaN-on-Si chips for fast charging devices from 65W chips...
Monday 28 December 2020
GaN-on-SiC application to 5G base stations ramping up in US, Europe
Vendors in the US and Europe are ramping up application of third-generation semiconductor materials including SiC (silicon carbide) and GaN to 5G base stations and EVs, according...
Thursday 26 November 2020
Taiwan III-V supply chain gearing up for GaN power, RF modules
Taiwan's III-V semiconductor supply chain players are gearing up to deepen deployments in the segment of GaN-based power components and RF modules increasingly applied to 5G handsets...
Thursday 15 October 2020
Adoption of GaN fast chargers among consumer products to grow fast in 2021
The adoption of GaN-based fast charging devices among smartphones and other consumer technology products is expected to grow rapidly starting 2021, according to industry sources.
Wednesday 14 October 2020
IDMs, III-V players gearing up for GaN-on-SiC RF, PA components
International IDMs are keenly developing GaN-on-SiC RF and PA components to tap immense opportunities from communication applications, and Taiwan's III-V players including foundry...