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NEWS TAGGED GOLD BUMPING
Wednesday 8 April 2009
Driver IC packaging firms to reach full utilization by end of 2Q09
Taiwan-based LCD driver IC packaging and testing houses are expected to see their fabs running at full capacity by the end of the second quarter, as more Japan-based IDMs have begun...
Thursday 29 May 2008
Chipbond and IST prepare further price raise for gold bumping in 3Q08
Chipbond Technology and International Semiconductor Technology (IST) are preparing to increase gold bumping quotes for the second consecutive quarter in the third quarter in order...