The proliferating artificial intelligence (AI) applications are generating significant growth potential in demand for next-generation high bandwidth memory (HBM) chips, driving South...
After achieving breakthroughs in production technologies for high bandwidth memory (HBM) and 300-layer NAND flash chips, SK Hynix is accelerating the development of the next-generation...
Seeing Nvidia's excellent revenue performance in the second quarter of 2023 and the reported plan to expand the production of AI chips like H100, South Korean memory makers like Samsung...
High-end AI server shipments are forecast to reach 337,000 units in 2024, with the generative AI market reaching US$109 billion by 2030, at a compound annual growth rate (CAGR) of...
With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...
According to a recent report by TrendForce, memory manufacturers are expanding their production capacities to satisfy the rising demand for processors designed in-house by CSPs. This...
SK Hynix has successfully developed a next-generation high bandwidth memory (HBM) called HBM3E, and has provided samples to Nvidia for performance evaluation, according to a company...
Applied Materials, the leading semiconductor equipment supplier, announced third-quarter results that significantly exceeded anticipations and expects data centers, EVs, and industrial...
The AI trend has fueled the high-bandwidth memory (HBM) business opportunities, which in turn has brought attention to related equipment supplier Hanmi Semiconductor. Recently, to...
Amidst a global economic slowdown, Samsung Electronics is establishing a "Future Technology Office," hoping to be the first to develop new technology, improve product competitiveness,...
According to Business Korea, there are rumors suggesting that Samsung foundry, including its System LSI division, may experience losses of up to 1 trillion KRW (approximately...
Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed...
Samsung Electronics is on track to expand production cutbacks on both DRAM and NAND flash chips to accelerate a memory market rebound in the second half of 2023, after its Device...
Micron Technology has announced that it has begun sampling what it calls the industry's first 8-high 24GB HBM3 Gen2 memory with bandwidth greater than 1.2TB/s and pin speed over 9.2Gb/s,...
With the rapidly rising popularity of generative AI, high bandwidth memory (HBM) and graphics processing units (GPU) have become highly sought-after components. However, as the semiconductor...
