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NEWS TAGGED HEAT PIPE
Monday 5 July 2021
The world's biggest micro heat pipe maker enters fully-automated ultra-thin MagicWick-Inside vapor chamber production
YCTek, the world biggest micro heat pipe manufacturer, has reached a formal patent license agreement with NeoGene Tech to adopt PWS (Print Wick Structuring) approach and MagicWick-Inside...
Monday 14 September 2020
Apple reportedly initiating automated heat pipe production at supply chain
Apple is reportedly working with its heat dissipation solution providers on production line automation with aims to automize manufacturing processes for heat pipe production initially,...
Wednesday 25 December 2019
Intel to intro innovative thermal design for notebooks
At the upcoming CES 2020, Intel is planning to announce a new thermal module design that is able to enhance notebooks' heat dissipation by 25-30% with many brands also set to showcase...
Monday 18 November 2019
Forcecon introduces new cooling solutions for notebooks, smartphones
Taiwan-based heat dissipation solution provider Forcecon Technology has introduced a new form of heat pipe, thermal ground plane (TGP), thickened 0.2mm for notebook and smartphone...
Tuesday 29 October 2019
Samsung, Huawei embracing VC cooling solutions for smartphones
Use of vapor chamber cooling modules for smartphones is set to expand significantly in 2020 as Samsung Electronics and Huawei are likely to have all of their 5G phones slated for...
Monday 2 September 2019
Taiwan component makers seek opportunities from 5G and foldable devices
Taiwan-based component makers, despite seeing shrinking demand for notebooks, have found new opportunities from emerging businesses such as foldable smartphones, foldable-screen notebooks...
Thursday 8 August 2019
Samsung pioneers adoption of 0.35mm vapor chamber in new Galaxy series
Samsung Electronics has taken the lead to adopt 0.35mm vapor chambers (VC) in its newly released Galaxy Note 10 series, which may become mainstream smartphone heat-sinking spec in...
Thursday 11 July 2019
Vapor chamber to account for 50% of smartphone cooling module shipments in 2H19
With rising heat dissipation demand from major vendors including Samsung Electronics, LG Electronics, Huawei, Oppo and Xiaomi for their 5G smartphones, half of cooling module shipments...
Wednesday 19 September 2018
Cooling module firms see server demand accelerate
Cooling module makers including Auras Technology, Chaun-Choung Technology (CCI) and Taisol Electronics have seen demand from the server sector accelerate since the beginning of second-half...
Friday 17 August 2018
Auras optimistic about 3Q18
Cooling module maker Auras Technology expects its third-quarter-2018 revenues to grow 15-20% sequentially with gross margin to also increase to 14-16%, up from second-quarter's 10%,...
Friday 17 November 2017
Samsung to continue adopting heat pipes for smartphones in 2018
Despite the recent market rumors indicating that Samsung Electronics may stop using heat pipes for its new smartphones in 2018, sources from upstream supply chain players have pointed...
Tuesday 4 July 2017
Auras enjoys orders from servers, graphics cards and smartphones in 2017, says report
Taiwan-based cooling module maker Auras is expected to enjoy a strong second half thanks to new orders for server-related products, increasing demand for graphics card cooling modules...
Tuesday 4 July 2017
CCI expects rising demand in 2H17, says paper
Cooling module maker Chaun-Choung Technology (CCI) expects its products for servers and notebooks to enjoy strong demand in the second half because of seasonality. Second-half revenues...
Wednesday 21 June 2017
Cooling module maker CCI starts production at new factory in China
Thermal module maker Chaung Choung Technology (CCI) is moving manufacturing equipment from a factory on lease in Chongqing, western China, to a newly constructed factory nearby. So...
Friday 9 June 2017
Auras Technology sees smartphone heat-pipe demand remain brisk in 2017
Heat-dissipation solution vendor Auras Technology, which reportedly is a major heat-pipe supplier for Samsung Electronics' Galaxy S8 smartphones, expects demand for heat-pipes from...
May 27, 10:24
Empower manufacturing with AI: Into new era of smart manufacturing with collective wisdom
Tuesday 24 May 2022
MSI unveils new lineup at Computex 2022 Online
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Thursday 19 May 2022
Computex Focus: DataVan to showcase new retail solutions for new normal
Renesas to reopen Kofu factory as 300mm wafer fab dedicated for power semiconductors
IC design houses bracing for cutback in orders from China handset brands
TSMC to move CoWoS-L technology to commercial production in 2 years
Intel makes key investments to advance datacenter sustainability
Concerns rising over potential foundry overcapacity in 2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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