YCTek, the world biggest micro heat pipe manufacturer, has reached a formal patent license agreement with NeoGene Tech to adopt PWS (Print Wick Structuring) approach and MagicWick-Inside...
Apple is reportedly working with its heat dissipation solution providers on production line automation with aims to automize manufacturing processes for heat pipe production initially,...
At the upcoming CES 2020, Intel is planning to announce a new thermal module design that is able to enhance notebooks' heat dissipation by 25-30% with many brands also set to showcase...
Taiwan-based heat dissipation solution provider Forcecon Technology has introduced a new form of heat pipe, thermal ground plane (TGP), thickened 0.2mm for notebook and smartphone...
Use of vapor chamber cooling modules for smartphones is set to expand significantly in 2020 as Samsung Electronics and Huawei are likely to have all of their 5G phones slated for...
Taiwan-based component makers, despite seeing shrinking demand for notebooks, have found new opportunities from emerging businesses such as foldable smartphones, foldable-screen notebooks...
Samsung Electronics has taken the lead to adopt 0.35mm vapor chambers (VC) in its newly released Galaxy Note 10 series, which may become mainstream smartphone heat-sinking spec in...
With rising heat dissipation demand from major vendors including Samsung Electronics, LG Electronics, Huawei, Oppo and Xiaomi for their 5G smartphones, half of cooling module shipments...
Cooling module makers including Auras Technology, Chaun-Choung Technology (CCI) and Taisol Electronics have seen demand from the server sector accelerate since the beginning of second-half...
Cooling module maker Auras Technology expects its third-quarter-2018 revenues to grow 15-20% sequentially with gross margin to also increase to 14-16%, up from second-quarter's 10%,...
Despite the recent market rumors indicating that Samsung Electronics may stop using heat pipes for its new smartphones in 2018, sources from upstream supply chain players have pointed...
Taiwan-based cooling module maker Auras is expected to enjoy a strong second half thanks to new orders for server-related products, increasing demand for graphics card cooling modules...
Cooling module maker Chaun-Choung Technology (CCI) expects its products for servers and notebooks to enjoy strong demand in the second half because of seasonality. Second-half revenues...
Thermal module maker Chaung Choung Technology (CCI) is moving manufacturing equipment from a factory on lease in Chongqing, western China, to a newly constructed factory nearby. So...
Heat-dissipation solution vendor Auras Technology, which reportedly is a major heat-pipe supplier for Samsung Electronics' Galaxy S8 smartphones, expects demand for heat-pipes from...
