Following Samsung Electronics' adoption of heat-pipes for its Galaxy S7 and Galaxy Note 7, Korea-based LG Electronics reportedly is also planning to adopt heat-pipes for smartphones...
Due to increasing competition for orders for ultra-thin copper-based heat-pipes used in smartphones, prices for pipes with a diameter of 0.4mm have dropped from US$1 in early 2016...
Samsung Electronics has adopted heat-pipes for its Galaxy S7-series, and this is expected to become a trend in the smartphone industry bringing business opportunities for heat-pipe...
Cooling module makers such as Japan-based Furukawa Electric Group and Fujikura and Taiwan-based Chaun-Choung Technology and Taisol Electronics, are looking to reduce the thickness...
Cooling module demand from tablets is rising in 2013 as average power consumption of ARM-based processors has increased significantly from 3W in the past to 6-7W currently and heat...
Taiwan-based ShineMore Technology Materials, a maker of copper clad laminates (CCL), has stepped up its efforts to to expand the application of its products. According to company...
Japan-based Furukawa Electric on January 25 filed with Taiwan's Intellectual Property Court charging Chaun-Choung Technology (CCI) with infringement of its Taiwan patent No.121526...
Taiwan-based cooler module makers Auras Technology and Chaun-Choung Technology (CCT) plan to expand their heat-pipe capacities and expect the new lines to start production in the...
