According to Intel, Boeing and Northrop Grumman have joined phase two of the Department of Defense's RAMP-C program, which aims to facilitate a leading-edge US foundry ecosystem on...
Amid the ongoing US-China trade war, Chinese communication system giants such as Huawei and ZTE have taken a low-key approach on the international stage, but back in their home country,...
A breakthrough in ultra-high density heterogeneous integration has been achieved through an academic collaboration between Taiwan and the US as part of a research project under the...
Nicky Lu, founder and CEO of Etron Technology, pioneered the concept of "heterogeneous integration" and further developed the theory of monolithic & heterogeneous integration...
Samsung Electronics and SK Hynix have revealed the latest development trends for advanced logic chips technology and memory products at recent technology symposiums, with the former...
In helping TSMC maintain its leading edge, the government has approved funding support for a spate of R&D projects undertaken by academic research teams, aiming to fill related...
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips...
NeoFuse, a security-enhanced version of eMemory's one-time programmable (OTP) non-volatile memory (NVM) technology, has been qualified on the TSMC N5 process. Another design tape-out...
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, has reported revenue and net profits for 2022 both hit record highs of CNY33.76 billion (US$4.91...
High-profile semiconductor industry leaders in China recently gathered at the just-ended SEMICON China Executive Summit seeking to find ways out for China's future IC development...
As the semiconductor industry once again frets over the future of Moore's Law, the notion of chiplets has gained traction, especially as the technology has come to be prominently...
Automotive chips and power devices continue to see uneven supplies, and Taiwan's leading OSATs including ASE Technology and international IDMs such as Infineon, Renesas, NXP, ST Microelectronics...
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
Taiwan IC test interface solutions providers continue to embrace robust demand from major US HPC processor vendors Intel, Nvidia and AMD, which will effectively offset reductions...
